Vishay

CSC09A011K00JPA

CSC09A011K00JPA Description

The CSC09A011K00JPA from Vishay is a high-reliability 8-resistor thick film network designed for precision applications. Encased in a conformal-coated 9-pin SIP package, it offers a 1KΩ resistance per element with a 5% tolerance and ±100ppm/°C temperature coefficient. Rated for 1.12W total power dissipation (0.2W per resistor) and 100V maximum voltage, it operates across a wide temperature range of 25°C to 150°C (derated) and 125°C maximum ambient temperature. Its through-hole pin termination and 2.54mm pitch ensure compatibility with standard PCB layouts. The conformal coating enhances durability in harsh environments, though it is non-compliant with EU RoHS.

CSC09A011K00JPA Features

• Robust Construction: Conformal-coated SIP package resists moisture and contaminants.
• High Power Handling: 1.12W total dissipation (0.2W per resistor) for demanding circuits.
• Stable Performance: ±100ppm/°C TCR ensures minimal resistance drift.
• BUS Designator: Optimized for bus termination and pull-up/down applications.
• Through-Hole Reliability: 9-pin SIP with 2.54mm pitch for secure mounting.
• Wide Operating Range: -55°C to +125°C (derated power up to 150°C).

CSC09A011K00JPA Applications

Ideal for industrial control systems, power supplies, and automotive electronics (non-automotive qualified), this network excels in:

• Voltage divider circuits requiring stable resistance values.
• Bus termination in digital communication systems (e.g., CAN, I2C).
• Pull-up/pull-down networks in microcontroller interfaces.
• Harsh environments where conformal coating mitigates corrosion.

Conclusion of CSC09A011K00JPA

The CSC09A011K00JPA combines high power density, environmental resilience, and consistent performance, making it a superior choice for precision analog and digital circuits. While not RoHS-compliant, its thick film technology and conformal coating provide long-term reliability in industrial and commercial applications. Engineers will appreciate its balance of cost-effectiveness and durability in space-constrained designs.