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D55342H07B332ERWS
52-D55342H07B332ERWS
PDF Datasheet
Res Thin Film 1206 332K Ohm 1% 1/4W 50ppm/C 0.01% Molded SMD SMD Waffle Pack
17 weeks
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Tech Specifications
Package/Case
1206
Contact Plating
Tin, Lead
Failure Rate
0.01%
Features
Military
Height
0.033inch
Length
0.126inch
Max Operating Temperature
150°C
Max Power Dissipation
250mW
D55342H07B332ERWS Description
Res Thin Film 1206 332K Ohm 1% 1/4W 50ppm/C 0.01% Molded SMD SMD Waffle Pack
FAQ
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Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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