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D55342K07B1E96SWB
52-D55342K07B1E96SWB
PDF Datasheet
Res Thick Film 1206 1.96K Ohm 1% 1/4W 100ppm/C 0.001% Molded SMD SMD Tray
13 weeks
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Tech Specifications
Package/Case
1206
Contact Plating
Tin, Lead
Max Operating Temperature
150°C
Military Standard
MIL-PRF-55342
Min Operating Temperature
-55°C
Packaging
Waffle
Radiation Hardening
No
Resistance
1.96kR
D55342K07B1E96SWB Description
Res Thick Film 1206 1.96K Ohm 1% 1/4W 100ppm/C 0.001% Molded SMD SMD Tray
FAQ
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