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D55342K07B267DSWB
52-D55342K07B267DSWB
PDF Datasheet
Res Thick Film 1206 267 Ohm 1% 1/4W 100ppm/C 0.001% Molded SMD SMD Tray
13 weeks
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Tech Specifications
Package/Case
1206
Contact Plating
Tin, Lead
Max Operating Temperature
150°C
Military Standard
MIL-PRF-55342
Min Operating Temperature
-55°C
Packaging
Waffle
Radiation Hardening
No
Resistance
267R
D55342K07B267DSWB Description
Res Thick Film 1206 267 Ohm 1% 1/4W 100ppm/C 0.001% Molded SMD SMD Tray
FAQ
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D55342K07B267DSWB is currently available on an inquiry basis. Please contact us for the latest stock information.
What package or case is D55342K07B267DSWB available in?
What operating temperature range does D55342K07B267DSWB support?
What is the standard lead time for D55342K07B267DSWB?
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