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D55342K07B69D8SWB
52-D55342K07B69D8SWB
PDF Datasheet
Res Thick Film 1206 69.8 Ohm 1% 1/4W ±100ppm/C 0.001% Molded SMD Tray
13 weeks
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Tech Specifications
Package/Case
1206
Contact Plating
Tin, Lead
Max Operating Temperature
150°C
Military Standard
MIL-PRF-55342
Min Operating Temperature
-55°C
Packaging
Waffle
Radiation Hardening
No
Resistance
69.8R
D55342K07B69D8SWB Description
Res Thick Film 1206 69.8 Ohm 1% 1/4W ±100ppm/C 0.001% Molded SMD Tray
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