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MDP1401100KGE04

MDP1401100KGE04 Description

The MDP1401100KGE04 from Vishay Dale is a high-precision 13-resistor bussed network housed in a 14-pin DIP package. Designed for through-hole mounting, this 100kΩ array offers a compact footprint of 19.05mm x 6.35mm (0.750" x 0.250") with a low-profile height of 3.94mm (0.155"). It features a tight ±2% tolerance and a stable ±100ppm/°C temperature coefficient, ensuring reliable performance across industrial temperature ranges. The 125mW power rating per element and ROHS3 compliance make it suitable for modern, environmentally conscious designs. Packaged in a protective tube, it is ideal for automated assembly processes.

MDP1401100KGE04 Features

• 13 bussed resistors in a single 14-pin DIP, reducing PCB space and assembly complexity.
• ±2% tolerance and ±100ppm/°C TCR for precision applications.
• 125mW power dissipation per resistor, balancing performance and thermal management.
• Through-hole design ensures robust mechanical stability in harsh environments.
• ROHS3 compliant and MSL 1 (Unlimited) for unrestricted shelf life and lead-free compatibility.
• EAR99 / HTSUS 8533.21.0060 classification simplifies global logistics.

MDP1401100KGE04 Applications

This resistor network excels in analog signal conditioning, voltage division, and pull-up/pull-down circuits in:

• Industrial control systems requiring stable, high-density resistor arrays.
• Power management modules where consistent resistance values are critical.
• Test and measurement equipment benefiting from low TCR and tight tolerance.
• Legacy through-hole designs needing reliable, space-efficient solutions.

Conclusion of MDP1401100KGE04

The MDP1401100KGE04 combines Vishay Dale’s proven reliability with a compact, high-performance design. Its bussed architecture, precision tolerances, and industrial-grade robustness make it a standout choice for engineers seeking efficiency in space-constrained or high-reliability applications. Whether for legacy upgrades or new designs, this array delivers consistent performance with minimal footprint overhead.