Vishay

MDP1601220RJD04

MDP1601220RJD04 Description

The MDP1601220RJD04 from Vishay is a high-performance thick film resistor network designed for precision applications requiring stable resistance characteristics. This 16-pin DIP (Dual In-Line Package) device integrates 15 resistors, each rated at 220Ω with 5% tolerance, delivering a total power rating of 1.92W (0.125W per resistor). Its thick film technology ensures reliable performance across a wide temperature range of 25°C to 150°C, with a low temperature coefficient of ±100ppm/°C for minimal resistance drift. The molded, rectangular package offers robust mechanical protection, while the 2.54mm terminal pitch simplifies PCB layout and through-hole mounting.

MDP1601220RJD04 Features

• High-Density Integration: 15 resistors in a compact DIP-16 package (21.59mm x 7.87mm x 3.81mm), ideal for space-constrained designs.
• Enhanced Thermal Performance: Rated for 125°C maximum operating temperature with derated power up to 150°C, ensuring reliability in demanding environments.
• Stable Thick Film Construction: Low TCR (±100ppm/°C) and 5% tolerance provide consistent performance in analog/digital circuits.
• Automated Assembly Compatibility: Pin termination and tube packaging streamline high-volume production.
• Non-Automotive Compliance: Suitable for industrial and consumer electronics (PPAP not required).

MDP1601220RJD04 Applications

This resistor network excels in:

• Signal Conditioning: Voltage dividers, pull-up/pull-down networks in microcontrollers and logic circuits.
• Analog Systems: Precision feedback networks for op-amps, DACs, and ADCs.
• Power Management: Current-limiting and load-sharing in low-power DC/DC converters.
• Legacy Equipment: DIP compatibility makes it ideal for servicing older PCB designs.

Conclusion of MDP1601220RJD04

The MDP1601220RJD04 stands out for its balance of power handling, stability, and integration density, making it a versatile choice for industrial controls, test equipment, and embedded systems. While not RoHS-compliant, its molded durability and thick film reliability cater to applications where long-term performance outweighs regulatory constraints. Engineers will appreciate its ease of integration and consistent performance across thermal and electrical stress conditions.