Vishay

MSP06A01100RGDA

MSP06A01100RGDA Description

The MSP06A01100RGDA from Vishay is a high-performance thick film resistor network designed for precision applications in electronic circuits. This 6-pin SIP (Single In-line Package) device integrates five 100Ω resistors with a tight 2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 25°C to 150°C. With a 0.75W (3/4W) total power rating (0.2W per resistor) and a maximum voltage rating of 100V, it is engineered for reliability in demanding environments. The molded epoxy case provides robust mechanical protection, while the through-hole pin termination ensures secure mounting on PCBs. Packaged in a tube, this non-automotive, non-PPAP compliant component is ideal for industrial and commercial applications where consistent resistance values are critical.

MSP06A01100RGDA Features

• Circuit Designator: BUS configuration for streamlined integration.
• High Power Handling: 0.75W total (0.2W per resistor) with derated performance up to 150°C.
• Precision Tolerance: 2% resistance deviation and ±100ppm/°C thermal stability.
• Durable Construction: Molded epoxy casing for enhanced mechanical and environmental resistance.
• Standard SIP Package: 14.99mm length, 2.29mm depth, and 4.95mm height with 2.54mm pin pitch for compatibility with industry layouts.
• Through-Hole Mounting: Secure PCB attachment for high-vibration environments.
• Non-RoHS Compliant: Suitable for legacy or specialized applications where RoHS restrictions do not apply.

MSP06A01100RGDA Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision resistance values ensure accurate signal conditioning.
• Industrial Control Systems: Reliable performance in PLC modules, motor drives, and power supplies.
• Test & Measurement Equipment: Stable thermal characteristics for calibration and sensing circuits.
• Legacy Electronics Repair: Non-RoHS compliance makes it a fit for older systems.
• Embedded Systems: Compact SIP footprint saves space in dense PCB designs.

Conclusion of MSP06A01100RGDA

The MSP06A01100RGDA stands out for its robust construction, precision tolerances, and high power dissipation in a compact SIP package. Its thick film technology and molded epoxy casing make it a dependable choice for industrial, commercial, and legacy applications where durability and electrical stability are paramount. While not suited for automotive use, its ease of integration and consistent performance solidify its role in critical circuit designs.