Vishay

MSP06A0110K0GDA

MSP06A0110K0GDA Description

The MSP06A0110K0GDA from Vishay is a high-performance thick-film resistor network designed for precision applications. This 6-pin SIP (Single In-line Package) device integrates five 10KΩ resistors with a 2% tolerance, offering a ±100ppm/°C temperature coefficient for stable operation across a -25°C to +150°C derated power range. With a 0.75W (3/4W) total power rating (0.2W per resistor) and a 100V maximum voltage rating, it suits demanding circuits requiring reliability and compactness. The molded epoxy case ensures durability, while the 2.54mm terminal pitch and through-hole mounting simplify PCB integration.

MSP06A0110K0GDA Features

• Circuit Designator: BUS configuration for streamlined bus termination or pull-up/down applications.
• Robust Construction: Molded epoxy package enhances mechanical and thermal stability.
• High Power Handling: 0.75W total power dissipation (0.2W per resistor) at 125°C max operating temperature.
• Precision: Tight 2% tolerance and low ±100ppm/°C TCR ensure consistent performance.
• Standardized Footprint: 6-pin SIP with 14.99mm length, 4.95mm height, and 2.29mm depth for compatibility with industry layouts.
• Non-Automotive Grade: Ideal for industrial and consumer electronics (PPAP not required).

MSP06A0110K0GDA Applications

• Bus Termination/Voltage Division: Used in digital systems (e.g., I²C, SPI) for impedance matching.
• Signal Conditioning: Integrates into analog circuits for gain setting or biasing.
• Power Supplies: Acts as a bleed resistor or feedback network in DC/DC converters.
• Industrial Controls: Reliable performance in PLCs, sensors, and test equipment.
• Consumer Electronics: Space-saving solution for audio/video devices and set-top boxes.

Conclusion of MSP06A0110K0GDA

The MSP06A0110K0GDA excels in compact, multi-resistor applications where precision, power efficiency, and durability are critical. Its thick-film technology and standard SIP package make it a versatile choice for industrial, consumer, and communication systems. While not RoHS-compliant, its robust design and ease of integration position it as a cost-effective alternative for non-automotive environments. Engineers benefit from its balanced trade-offs between performance, size, and thermal management.