Vishay

MSP06A01470RGEJ

MSP06A01470RGEJ Description

The MSP06A01470RGEJ from Vishay is a high-performance thick film resistor network designed for precision applications in industrial and consumer electronics. This 6-pin SIP (Single In-line Package) device integrates five 470Ω resistors with a 2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of -55°C to +125°C. The network is housed in a molded epoxy case, offering robust mechanical protection and environmental resistance. With a maximum voltage rating of 100V and a total power rating of 0.75W (3/4W), it is ideal for compact designs requiring reliable signal conditioning or voltage division.

MSP06A01470RGEJ Features

• High Power Handling: 0.2W per resistor (total 0.75W) enables use in higher-current circuits.
• Precision Tolerance: 2% resistance tolerance ensures accurate signal processing.
• Stable Performance: ±100ppm/°C TCR minimizes resistance drift under thermal stress.
• Durable Construction: Molded epoxy case provides mechanical strength and moisture resistance.
• Space-Saving SIP Package: 14.99mm length, 4.57mm height suits high-density PCB layouts.
• Through-Hole Mounting: 2.54mm pin pitch simplifies assembly and enhances reliability.
• Automotive-Grade Alternatives: While not automotive-qualified, its 125°C max operating temperature makes it suitable for industrial environments.

MSP06A01470RGEJ Applications

This resistor network excels in:

• Voltage Dividers: Precision ladder networks in ADC/DAC circuits.
• Pull-Up/Pull-Down Arrays: Bus termination in digital systems (e.g., I²C, SPI).
• Signal Conditioning: Analog front-ends for sensors or op-amp circuits.
• Power Supplies: Feedback networks in DC-DC converters.
• Industrial Controls: PLCs, motor drives, and instrumentation requiring stable resistance values.

Conclusion of MSP06A01470RGEJ

The MSP06A01470RGEJ combines precision, power efficiency, and compactness, making it a versatile choice for engineers designing reliable, space-constrained electronics. Its thick film technology and robust epoxy encapsulation ensure longevity in harsh environments, while the SIP package simplifies integration. Though not PPAP or automotive-certified, its wide temperature range and low TCR make it a cost-effective solution for industrial and consumer applications demanding consistent performance.