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MSP08A0151R0GDA
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MSP08A0151R0GDA Description
MSP08A0151R0GDA Description
The MSP08A0151R0GDA from Vishay is a high-performance thick film resistor network designed for precision applications in electronic circuits. This 7-resistor network features a 51Ω resistance value per resistor with a tight 2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across a broad temperature range of 25°C to 150°C. Housed in an 8-pin SIP (Single In-line Package) with molded epoxy construction, it offers robust mechanical protection and reliable through-hole mounting. The device is rated for 1W total power dissipation (0.2W per resistor) and supports a maximum voltage rating of 100V, making it suitable for moderate-power applications.
MSP08A0151R0GDA Features
- Circuit Designator: BUS configuration for streamlined integration.
- Thick Film Technology: Delivers high reliability and consistent performance.
- Compact SIP Package: Measures 20.07mm (L) × 2.29mm (D) × 4.95mm (H) with a 2.54mm terminal pitch, optimizing PCB space.
- Wide Temperature Range: Operates from 25°C to 150°C with derated power, ensuring stability in varying environments.
- High Power Handling: 1W total (0.2W per resistor) capability, superior to many standard networks.
- Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance is not required.
MSP08A0151R0GDA Applications
This resistor network excels in bus termination, pull-up/pull-down circuits, and voltage divider networks in:
- Industrial Control Systems: Stable performance in PLCs and motor drives.
- Telecommunications Equipment: Signal conditioning and impedance matching.
- Test & Measurement Devices: Precision resistance networks for calibration.
- Consumer Electronics: Durable solution for power management circuits.
Conclusion of MSP08A0151R0GDA
The MSP08A0151R0GDA stands out for its robust construction, precise tolerance, and high power rating, making it a versatile choice for engineers seeking reliability in moderate-power, space-constrained designs. Its thick film technology and molded epoxy case ensure longevity, while the SIP package simplifies assembly. Though not RoHS-compliant, it remains a cost-effective solution for industrial and commercial applications demanding consistent performance under thermal stress.



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