Vishay

MSP08C01100KJDA

MSP08C01100KJDA Description

The MSP08C01100KJDA from Vishay is a high-performance 7-resistor thick film network designed for precision applications requiring stable resistance values and robust power handling. Encased in a molded epoxy SIP (Single In-line Package), this 8-pin through-hole component offers a 100K Ohm resistance per element with a 5% tolerance and a ±100ppm/°C temperature coefficient. Its 1.3W total power rating (0.25W per resistor) and 100V maximum voltage rating ensure reliability in demanding circuits. The 20.07mm length, 2.29mm depth, and 8.89mm height make it compact yet durable, suitable for industrial and commercial PCB designs.

MSP08C01100KJDA Features

• Circuit Designator: BUS – Optimized for bus line applications.
• Thick Film Technology – Delivers stable performance across a -25°C to +150°C derated temperature range (operating up to 125°C).
• High Power Handling – 1.3W total dissipation (0.25W per resistor) outperforms standard networks.
• Precision Tolerance – 5% tolerance and ±100ppm/°C TCR ensure consistent performance.
• Robust Construction – Molded epoxy case and pin termination provide mechanical strength and solderability.
• Through-Hole Mounting – 2.54mm terminal pitch simplifies PCB assembly.

MSP08C01100KJDA Applications

Ideal for:

• Voltage Division in analog/digital hybrid circuits.
• Bus Termination in communication and computing systems.
• Pull-Up/Pull-Down Networks in microcontroller and logic circuits.
• Industrial Control Systems requiring high-temperature stability.
• Power Supply Feedback Networks due to its low TCR and derating capability.

Conclusion of MSP08C01100KJDA

The MSP08C01100KJDA stands out for its high power rating, thick film reliability, and compact SIP package, making it a superior choice for precision networks in harsh environments. While non-automotive and non-RoHS compliant, its broad temperature range and robust design cater to industrial, telecom, and embedded systems. Engineers will appreciate its balance of performance, durability, and ease of integration in through-hole designs.