Vishay

MSP08C01100RGDA

MSP08C01100RGDA Description

The MSP08C01100RGDA from Vishay is a high-performance thick film resistor network designed for precision applications. This 7-resistor array features a 100Ω resistance value per resistor with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying thermal conditions. Housed in an 8-pin SIP (Single In-line Package) with molded epoxy construction, it offers robust mechanical protection and reliable through-hole mounting. The device operates within a wide temperature range of 25°C to 150°C (derated) and can withstand a maximum voltage rating of 100V, making it suitable for demanding environments. With a total power rating of 1.3W (0.25W per resistor), it balances power dissipation and compactness.

MSP08C01100RGDA Features

• Circuit Designator: BUS configuration for streamlined integration.
• Thick Film Technology: Delivers high reliability and consistent performance.
• Molded Epoxy Case: Enhances durability and resistance to environmental stress.
• Pin Termination & Through-Hole Mounting: Ensures secure PCB attachment.
• 8-Pin SIP Package: Compact 20.07mm length × 8.89mm height × 2.29mm depth footprint.
• 2.54mm Terminal Pitch: Compatible with standard PCB layouts.
• Non-Automotive (PPAP No): Ideal for industrial and commercial applications.

MSP08C01100RGDA Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision resistance matching in analog/digital systems.
• Bus Termination: Mitigates signal reflection in high-speed data lines.
• Industrial Control Systems: Stable performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Low TCR ensures accuracy in sensitive instrumentation.
• Consumer Electronics: Durable construction suits audio/video hardware and power management.

Conclusion of MSP08C01100RGDA

The MSP08C01100RGDA stands out for its combination of precision, power handling, and compact design. Its thick film technology and molded epoxy package provide superior reliability compared to thin-film alternatives, while the SIP format simplifies assembly. Though non-compliant with EU RoHS, it remains a cost-effective choice for non-regulated markets. Engineers will appreciate its balance of performance and versatility, particularly in industrial and communication systems where stable resistance networks are critical.