Vishay

MSP08C0110K0GDA

MSP08C0110K0GDA Description

The MSP08C0110K0GDA from Vishay is a high-performance 7-resistor thick film network designed for precision applications. Housed in an 8-pin SIP (Single In-line Package) with molded epoxy construction, it offers a 10KΩ resistance per resistor with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient. Rated for 1.3W total power dissipation (0.25W per resistor), it operates reliably across a wide temperature range of -55°C to +125°C, with derated performance up to 150°C. The through-hole pin termination and 2.54mm pitch ensure easy PCB integration, while its 100V maximum voltage rating makes it suitable for robust circuit designs.

MSP08C0110K0GDA Features

• Thick Film Technology: Ensures stable performance and durability in demanding environments.
• High Power Handling: 1.3W total power rating (0.25W per resistor) for energy-efficient designs.
• Precision Tolerance: 2% resistance tolerance and ±100ppm/°C TCR for consistent performance.
• Robust Construction: Molded epoxy case enhances mechanical strength and thermal stability.
• BUS Circuit Designator: Ideal for bus termination, pull-up/pull-down networks, and voltage divider applications.
• Through-Hole Mounting: 8-pin SIP package with 2.54mm pitch simplifies assembly and prototyping.
• Wide Operating Range: -55°C to +125°C (derated up to 150°C) ensures reliability in harsh conditions.

MSP08C0110K0GDA Applications

This resistor network excels in:

• Bus Termination & Signal Conditioning: Reduces reflections in high-speed digital circuits (e.g., memory modules, FPGA/CPLD interfaces).
• Voltage Dividers & Biasing: Precision resistance matching for sensor interfaces, ADC/DAC circuits.
• Industrial & Automotive Electronics: Suitable for control systems, power supplies, and instrumentation (though not PPAP/Automotive-certified).
• Consumer Electronics: Used in audio equipment, display drivers, and power management PCBs.

Conclusion of MSP08C0110K0GDA

The MSP08C0110K0GDA stands out for its high power density, precision tolerance, and robust SIP packaging, making it a versatile choice for digital and analog circuits. Its thick film construction ensures long-term reliability, while the BUS-oriented design simplifies layout in multi-resistor applications. Though not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and consumer electronics where stability and power handling are critical. Engineers will appreciate its ease of integration and consistent performance across temperature variations.