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MSP10A0133R0GDA
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MSP10A0133R0GDA Description
MSP10A0133R0GDA Description
The MSP10A0133R0GDA from Vishay is a high-performance thick film resistor network designed for precision applications requiring stable resistance values and robust power handling. This 9-resistor network features a 33 Ohm resistance per element with a tight 2% tolerance and a ±100ppm/°C temperature coefficient, ensuring reliable performance across a wide operating temperature range of 25°C to 150°C. Housed in a 10-pin SIP (Single In-line Package) with through-hole mounting, it offers a 1.25W total power rating (0.2W per resistor) and a maximum voltage rating of 100V. The molded epoxy case provides durability, while the 2.54mm terminal pitch ensures compatibility with standard PCB layouts.
MSP10A0133R0GDA Features
- Circuit Designator: BUS configuration for streamlined circuit design.
- High Power Handling: 1.25W total power dissipation (0.2W per resistor).
- Stable Performance: Low TCR (±100ppm/°C) and 2% tolerance for precision.
- Robust Construction: Molded epoxy case enhances mechanical and thermal stability.
- Standard Compatibility: 10-pin SIP with 2.54mm pitch for easy integration.
- Wide Temperature Range: Operates from 25°C to 150°C (derated) with a maximum operating temperature of 125°C.
- Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications.
MSP10A0133R0GDA Applications
This resistor network is ideal for:
- Voltage Division Circuits: Precision dividers in measurement equipment.
- Bus Termination: Effective for digital signal integrity in communication systems.
- Industrial Control Systems: Reliable performance in harsh environments.
- Power Supply Modules: Stable resistance for feedback and regulation.
- Test & Measurement Equipment: Low drift and high accuracy for calibration.
Conclusion of MSP10A0133R0GDA
The MSP10A0133R0GDA stands out for its combination of precision, power handling, and durability, making it a preferred choice for engineers designing high-reliability circuits. Its thick film technology and molded epoxy package ensure long-term stability, while the standard SIP footprint simplifies PCB assembly. While not RoHS compliant, it remains a robust solution for industrial, telecom, and instrumentation applications where performance and consistency are critical.



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