


Vishay
MSP10C01470RJDA
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
MSP10C01470RJDA Description
MSP10C01470RJDA Description
The MSP10C01470RJDA from Vishay is a high-performance thick film resistor network designed for precision applications in industrial and commercial electronics. This 10-pin SIP (Single In-line Package) device integrates nine 470Ω resistors with a 5% tolerance, offering a total power rating of 1.6W (0.25W per resistor). Its molded epoxy case ensures durability, while the ±100ppm/°C temperature coefficient guarantees stable performance across a wide operating range of -55°C to +125°C. The through-hole pin termination and 2.54mm terminal pitch facilitate easy PCB integration, making it ideal for automated assembly processes.
MSP10C01470RJDA Features
- High Power Handling: 1.6W total dissipation (0.25W per resistor) for robust operation.
- Stable Performance: Low TCR (±100ppm/°C) ensures minimal resistance drift under thermal stress.
- Durable Construction: Molded epoxy case resists mechanical and environmental stress.
- BUS Configuration: Optimized for bus termination, voltage division, and pull-up/down applications.
- Through-Hole Design: 10-pin SIP package with 2.54mm pitch for reliable PCB mounting.
- Wide Voltage Rating: Supports up to 100V, suitable for medium-voltage circuits.
MSP10C01470RJDA Applications
This resistor network excels in:
- Bus Termination: Ideal for digital systems requiring impedance matching (e.g., PCI, SCSI).
- Voltage Dividers: Precision dividers in analog signal conditioning circuits.
- Pull-Up/Down Networks: Ensures stable logic levels in microcontrollers and FPGAs.
- Industrial Controls: Reliable performance in harsh environments (e.g., motor drives, PLCs).
- Automotive (Non-Automotive Grade): Secondary systems where high-temperature stability is critical.
Conclusion of MSP10C01470RJDA
The MSP10C01470RJDA stands out for its balance of power, precision, and durability, making it a versatile choice for engineers designing robust electronic systems. Its thick film technology and molded epoxy package deliver long-term reliability, while the BUS configuration simplifies circuit design. Though not PPAP or automotive-grade, it remains a cost-effective solution for industrial, telecom, and computing applications demanding stable resistance networks.



.png)










.png?x-oss-process=image/format,webp/resize,h_32)










