Vishay

SOMC2005191AGRZ

SOMC2005191AGRZ Description

The SOMC2005191AGRZ from Vishay is a high-performance thick film resistor network designed for precision applications requiring stable resistance values and compact packaging. This 36-resistor array integrates dual resistance values (330Ω/470Ω) with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring reliable performance across a wide temperature range of 70°C to 150°C. Housed in a 20-pin SOIC package with gull-wing terminations, it offers a 1.52W total power rating (0.08W per resistor) and a 50V maximum voltage rating, making it suitable for dense PCB layouts. The molded, rectangular case (13.72mm x 7.62mm x 2.03mm) ensures durability, while the 1.27mm terminal pitch facilitates easy surface-mount assembly.

SOMC2005191AGRZ Features

• Dual Resistance Values: 330Ω and 470Ω resistors in a single network, reducing BOM complexity.
• High Power Handling: 1.52W total dissipation (0.08W per resistor) for robust operation.
• Stable Performance: ±100ppm/°C TCR and 2% tolerance ensure precision in varying conditions.
• Compact SOIC Package: 20-pin gull-wing SMD design (13.72mm x 7.62mm) saves board space.
• Wide Temperature Range: Operates from 70°C to 150°C with derated power capability.
• Automated Assembly Friendly: Supplied in tape and reel (T/R) for high-volume production.
• Non-Automotive Grade: Ideal for industrial and consumer electronics (PPAP not required).

SOMC2005191AGRZ Applications

This resistor network excels in:

• Signal Conditioning: Voltage dividers, pull-up/pull-down networks in IoT devices and sensors.
• Analog/Digital Circuits: Precision impedance matching in ADC/DAC interfaces.
• Power Management: Current-limiting and load-sharing in DC-DC converters.
• Industrial Controls: Durable performance in PLC modules and motor drivers.
• Consumer Electronics: Space-constrained designs like set-top boxes and audio equipment.

Conclusion of SOMC2005191AGRZ

The SOMC2005191AGRZ stands out for its dual-resistance integration, high power density, and stable thick film technology, making it a versatile choice for engineers prioritizing reliability and space efficiency. While not RoHS-compliant, its molded construction and SOIC packaging ensure durability in harsh environments. Ideal for industrial, consumer, and communication systems, this network simplifies design while delivering consistent performance.