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Y1692V0024TT0L

Y1692V0024TT0L Description

The Y1692V0024TT0L from VPG Foil Resistors is a high-precision 2-resistor network designed for voltage divider applications with TCR-matched performance. Part of the 300190Z series, this through-hole component features ultra-tight tolerances (±0.01%) and an exceptional resistor matching ratio of ±0.005%, ensuring minimal deviation in critical circuits. Its 4kΩ and 8kΩ resistance values are optimized for precise voltage division, while the ±0.2ppm/°C temperature coefficient and ±0.1ppm/°C ratio drift guarantee stability across extreme thermal conditions. The 14.61mm x 4.06mm footprint and 10.49mm height make it suitable for space-constrained layouts requiring radial mounting.

Y1692V0024TT0L Features

• Ultra-High Precision: ±0.01% tolerance and ±0.005% matching ratio for unmatched accuracy.
• Temperature Stability: ±0.2ppm/°C TCR and ±0.1ppm/°C ratio drift for reliable performance in fluctuating environments.
• Robust Power Handling: 300mW power dissipation per element.
• Durable Construction: Through-hole design with RoHS3 compliance and EAR99/ECCN certification.
• Low Noise: Ideal for sensitive analog circuits due to foil resistor technology.
• Non-MSIL: No moisture sensitivity concerns for simplified storage and handling.

Y1692V0024TT0L Applications

This resistor network excels in precision instrumentation, including:

• Reference voltage dividers in data acquisition systems.
• Calibration equipment requiring long-term stability.
• Medical devices (e.g., MRI analog front-ends) where TCR matching is critical.
• Aerospace/defense electronics demanding minimal drift over temperature.
• Metrology tools for high-accuracy signal conditioning.

Conclusion of Y1692V0024TT0L

The Y1692V0024TT0L sets a benchmark for precision resistor networks, combining VPG Foil’s expertise in ultra-stable foil technology with industry-leading tolerances. Its TCR-matched design and low drift make it indispensable for applications where even sub-ppm errors are unacceptable. For engineers prioritizing repeatability, thermal resilience, and compact form factors, this model outperforms conventional thin-film or wirewound alternatives. Available in bulk packaging, it’s a cost-effective solution for high-reliability systems.