Winbond Electronics Corporation_W25N01GVZEIG/TRAY
original

Winbond Electronics Corporation
W25N01GVZEIG/TRAY

774-W25N01GVZEIG/TRAY
PDF Datasheet
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 8-Pin WSON EP Tray

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Responsible quality
APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original
D&B

Tech Specifications

EU RoHS
Compliant
ECCN (US)
3A991b.1.a.
Part Status
LTB
SVHC
Yes
Automotive
No
PPAP
No
Cell Type
SLC NAND
Chip Density (bit)
1G
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W25N01GVZEIG/TRAY Description

SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 8-Pin WSON EP Tray

FAQ

What is the mounting type of W25N01GVZEIG/TRAY?
W25N01GVZEIG/TRAY uses a Surface Mount mounting style based on the listed product specifications.
Is W25N01GVZEIG/TRAY currently in stock?
What voltage specification is listed for W25N01GVZEIG/TRAY?
What is W25N01GVZEIG/TRAY?
What operating temperature range does W25N01GVZEIG/TRAY support?
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