Winbond Electronics Corporation_W25Q128FVPAQ
Winbond Electronics Corporation_W25Q128FVPAQ
original

Winbond Electronics Corporation
W25Q128FVPAQ

774-W25Q128FVPAQ
IC FLASH 8WSON

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Tech Specifications

Series
*
Package / Case
8-WDFN Exposed Pad
REACH Status
REACH Unaffected
Mfr
Winbond Electronics
ECCN
OBSOLETE
Package
Tube
Mounting Type
Surface Mount
Product Status
Obsolete
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W25Q128FVPAQ Description

W25Q128FVPAQ Description

The W25Q128FVPAQ is a high-performance Memory IC Chip manufactured by Winbond Electronics Corporation, a leading provider of semiconductor solutions. This 8-WSON package IC is designed for surface mount applications and is housed in a tube package. Despite its obsolete status, the W25Q128FVPAQ remains a reliable choice for various memory storage needs. The device is REACH unaffected, ensuring compliance with environmental and safety regulations. With a Moisture Sensitivity Level (MSL) of 3 (168 Hours), it is well-suited for environments where moisture resistance is crucial.

W25Q128FVPAQ Features

The W25Q128FVPAQ offers several unique features that set it apart from similar memory IC chips:

  • High Capacity Storage: With a base product number of W25Q128, this IC provides significant storage capacity, making it ideal for applications requiring substantial data retention.
  • Surface Mount Compatibility: The surface mount mounting type ensures easy integration into modern electronic designs, enhancing both flexibility and reliability.
  • Moisture Resistance: The MSL rating of 3 (168 Hours) makes this IC highly resistant to moisture, ensuring long-term stability and performance in humid environments.
  • Compliance and Safety: Being REACH unaffected, the W25Q128FVPAQ adheres to stringent environmental and safety standards, making it a responsible choice for environmentally conscious applications.
  • Programmability: Although not verified by DigiKey, the programmable nature of the W25Q128FVPAQ allows for customization to meet specific application requirements.

W25Q128FVPAQ Applications

The W25Q128FVPAQ is well-suited for a variety of applications due to its high capacity, surface mount compatibility, and moisture resistance. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems requiring reliable memory storage and resistance to environmental factors.
  • Industrial Automation: Suitable for industrial applications where moisture resistance and long-term stability are critical.
  • Consumer Electronics: Can be used in consumer electronics where compact design and high storage capacity are necessary.
  • Automotive Electronics: Applicable in automotive applications where environmental resilience and reliable performance are paramount.

Conclusion of W25Q128FVPAQ

In conclusion, the W25Q128FVPAQ is a versatile and reliable Memory IC Chip that offers significant storage capacity, surface mount compatibility, and moisture resistance. Despite its obsolete status, it remains a valuable option for applications requiring high performance and environmental resilience. With its REACH unaffected status and programmable nature, the W25Q128FVPAQ stands out as a responsible and customizable choice for various electronic systems.

FAQ

What is W25Q128FVPAQ?
W25Q128FVPAQ is a Memory ICs Products from Winbond Electronics Corporation. This product page provides its main specifications, pricing information, availability, and inquiry options.
What package or case is W25Q128FVPAQ available in?
What is the mounting type of W25Q128FVPAQ?
Is W25Q128FVPAQ currently in stock?
Are there related or alternative parts for W25Q128FVPAQ?
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