


Winbond Electronics Corporation
W25Q128FVSIG
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W25Q128FVSIG Description
W25Q128FVSIG
Product Overview
The W25Q128FVSIG is a 134,217,728-bit (128M‑bit) Serial NOR Flash memory device from Winbond Electronics, organized as 16M words × 8 bits. It provides a high-performance, low‑pin‑count storage solution for systems with limited space and power constraints, offering flexibility and performance well beyond ordinary serial flash devices. The device supports execute‑in‑place (XIP) capability, allowing code to be executed directly from the flash memory without shadowing to RAM.[reference:0][reference:1]
The W25Q128FV series supports a versatile interface with Standard SPI, Dual‑SPI, Quad‑SPI, and QPI (Quad Peripheral Interface) modes, enabling high‑speed data transfer. It operates over a supply voltage range of 2.7V to 3.6V and achieves a maximum clock frequency of 104 MHz. The device features a uniform 4KB sector architecture, providing flexible erase granularity, and supports a minimum of 100,000 program/erase cycles with 20 years of data retention. Housed in a standard 8‑pin SOIC (208 mil) package, it is suitable for a wide range of industrial and consumer applications.[reference:2][reference:3]
The W25Q128FVSIG also incorporates advanced protection features, including hardware and software write protection, an absolute write protection function, and a Write Enable latch. A power‑on reset circuit ensures reliable startup behavior.[reference:4] Additionally, the device supports Individual Block Locks, allowing any individual sector or block to be protected, as well as configurable output driver strength (100% / 75% / 50% / 25%) to optimize signal integrity for different system topologies.[reference:5] The /HOLD or /RESET pin function can be configured via the Status Register, providing further flexibility in multi‑master SPI environments.
📋 Technical Specifications
✨ Key Features
🎯 Typical Applications
128 – 128Mbit density
FV – Voltage: 2.7V – 3.6V
S – Package: SOIC‑8 (208 mil)
I – Industrial temperature range (-40°C to +85°C)
G – Lead‑free / RoHS compliant
Information compiled from Winbond product documentation and JEDEC SPI Flash standards.



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