Winbond Electronics Corporation_W29N01HWBINA TR
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Winbond Electronics Corporation
W29N01HWBINA TR

774-W29N01HWBINA TR
PDF Datasheet
IC FLASH 1GBIT ONFI 63VFBGA
22 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
ONFI
ECCN
3A991B1A
Memory Organization
64M x 16
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
63-VFBGA (9x11)
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W29N01HWBINA TR Description

W29N01HWBINA TR Description

The W29N01HWBINA TR is a high-performance, 1-Gbit NAND flash memory IC manufactured by Winbond Electronics Corporation. This device is designed for surface mount applications and is packaged in a Tape & Reel (TR) format, making it ideal for automated assembly processes. The memory is organized as 64M x 16, offering a robust and efficient storage solution for various electronic systems. With an access time of 22 ns and a write cycle time of 25 ns, the W29N01HWBINA TR ensures rapid data retrieval and writing capabilities. It operates within a supply voltage range of 1.7V to 1.95V, providing flexibility and compatibility with modern low-power systems.

W29N01HWBINA TR Features

  • Memory Interface: The W29N01HWBINA TR utilizes the ONFI (Open NAND Flash Interface) standard, ensuring compatibility with a wide range of controllers and systems.
  • Memory Size: With a 1-Gbit storage capacity, this IC offers substantial memory space for data-intensive applications.
  • Access Time: The 22 ns access time ensures quick data retrieval, enhancing overall system performance.
  • Write Cycle Time: The 25 ns write cycle time for words and pages allows for efficient data writing processes.
  • Voltage Range: The 1.7V to 1.95V supply voltage range provides flexibility and compatibility with low-power designs.
  • Moisture Sensitivity Level: MSL 3 (168 Hours) ensures the device is suitable for a variety of manufacturing environments.
  • Compliance: The W29N01HWBINA TR is REACH unaffected and ROHS3 compliant, meeting stringent environmental and safety regulations.
  • Mounting Type: Surface mount technology (SMT) enables easy integration into compact and high-density PCB designs.

W29N01HWBINA TR Applications

The W29N01HWBINA TR is well-suited for a variety of applications due to its high performance and compatibility. Key use cases include:

  • Consumer Electronics: Ideal for smartphones, tablets, and other portable devices requiring high-density storage solutions.
  • Embedded Systems: Suitable for industrial control systems, automotive electronics, and IoT devices where reliable and efficient memory is crucial.
  • Data Storage: Applicable in solid-state drives (SSDs) and other storage devices that demand rapid data access and write capabilities.
  • Networking Equipment: Useful in routers, switches, and other networking hardware that require robust memory solutions for firmware and data storage.

Conclusion of W29N01HWBINA TR

The W29N01HWBINA TR from Winbond Electronics Corporation stands out as a reliable and high-performance NAND flash memory IC. Its 1-Gbit capacity, rapid access and write times, and compatibility with ONFI standards make it a versatile choice for a wide range of applications. The device's low-power operation, surface mount packaging, and compliance with environmental regulations further enhance its appeal. Whether used in consumer electronics, embedded systems, or data storage solutions, the W29N01HWBINA TR offers a robust and efficient memory solution that meets the demands of modern electronic systems.

FAQ

What operating temperature range does W29N01HWBINA TR support?
W29N01HWBINA TR has an operating temperature range of -40°C ~ 85°C (TA).
What package or case is W29N01HWBINA TR available in?
Is W29N01HWBINA TR currently in stock?
What is W29N01HWBINA TR?
What voltage specification is listed for W29N01HWBINA TR?
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