Winbond Electronics Corporation
W631GG6KB15I

774-W631GG6KB15I
PDF Datasheet
IC DRAM 1GBIT PAR 96WBGA

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Tech Specifications

Clock Frequency
667 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
96-WBGA (9x13)
Access Time
20 ns
Package / Case
96-TFBGA
Technology
SDRAM - DDR3
Voltage - Supply
1.425V ~ 1.575V
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W631GG6KB15I Description

W631GG6KB15I Description

The W631GG6KB15I is a high-performance DRAM memory IC chip manufactured by Winbond Electronics Corporation. This 1Gbit memory device is organized as 64M x 16, offering a robust solution for applications requiring significant memory capacity. The W631GG6KB15I operates with a clock frequency of 667 MHz and an access time of 20 ns, ensuring rapid data retrieval and processing. It features a parallel memory interface, which is ideal for systems that require high-speed data transfer and efficient memory management.

The memory chip is designed for surface mount applications and comes in a 96-pin BGA package, making it suitable for compact and high-density PCB designs. The supply voltage range of 1.425V to 1.575V ensures compatibility with modern low-power systems. The W631GG6KB15I is classified as volatile memory, meaning it retains data only while power is supplied, which is typical for DRAM devices.

W631GG6KB15I Features

  • High-Speed Performance: With a clock frequency of 667 MHz and an access time of 20 ns, the W631GG6KB15I delivers rapid data access, making it suitable for high-speed computing and data-intensive applications.
  • Memory Organization: The 64M x 16 organization provides a large memory capacity of 1Gbit, ideal for systems requiring substantial memory resources.
  • Low-Power Operation: The voltage range of 1.425V to 1.575V ensures efficient power consumption, making it suitable for low-power and energy-efficient systems.
  • Parallel Interface: The parallel memory interface facilitates high-speed data transfer, ensuring efficient memory access and data processing.
  • Surface Mount Technology: The surface mount package type allows for compact and high-density PCB designs, making it ideal for modern electronic systems.
  • Compliance and Reliability: The W631GG6KB15I is REACH unaffected and ROHS3 compliant, ensuring it meets environmental and safety standards. It also has a moisture sensitivity level (MSL) of 3 (168 hours), making it suitable for various manufacturing environments.
  • Packaging: The device is packaged in trays, ensuring safe handling and storage during manufacturing and assembly processes.

W631GG6KB15I Applications

The W631GG6KB15I is well-suited for a variety of applications that require high-speed, high-capacity memory solutions. Some specific use cases include:

  • Networking Equipment: Ideal for routers, switches, and other networking devices that require rapid data processing and large memory capacity.
  • Telecommunications: Suitable for base stations and other telecommunication infrastructure that need efficient memory management for high-speed data transfer.
  • Industrial Control Systems: Applicable in industrial automation and control systems where real-time data processing and large memory storage are essential.
  • Consumer Electronics: Can be used in high-performance consumer electronics such as gaming consoles, multimedia devices, and advanced smart TVs.
  • Embedded Systems: Perfect for embedded systems that require compact, high-speed memory solutions for efficient operation.

Conclusion### of W631GG6KB15I

The W631GG6KB15I is a versatile and high-performance DRAM memory IC chip that offers significant advantages over similar models. Its high-speed operation, large memory capacity, and low-power consumption make it an ideal choice for a wide range of applications. The parallel memory interface and surface mount package type further enhance its suitability for modern electronic systems. Despite its obsolete status, the W631GG6KB15I remains a reliable and efficient memory solution for applications requiring robust and high-speed memory capabilities.

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