
Winbond Electronics Corporation
W632GU6NB09I TR
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W632GU6NB09I TR Description
W632GU6NB09I TR Description
The W632GU6NB09I TR is a high-performance DRAM memory IC chip manufactured by Winbond Electronics Corporation. This device is designed to meet the demands of modern electronics with its robust technical specifications and versatile applications. The chip features a clock frequency of 1.066 GHz, ensuring fast data processing and transfer rates. It operates within a supply voltage range of 1.283V to 1.45V, making it energy-efficient and suitable for a variety of power-sensitive applications.
The memory organization of 128M x 16 provides a total memory size of 2Gbit, offering ample storage capacity for complex data operations. The access time of 20 ns and a write cycle time of 15 ns for word and page operations ensure rapid data retrieval and storage, making it ideal for high-speed computing environments. The memory format is DRAM, which is volatile, meaning it retains data as long as power is supplied.
The W632GU6NB09I TR is packaged in a 96VFBGA format and is available in a Tape & Reel (TR) package, facilitating easy integration into surface mount designs. It is REACH unaffected and RoHS3 compliant, ensuring it meets the highest environmental and safety standards. The moisture sensitivity level (MSL) of 3 (168 hours) makes it suitable for a wide range of manufacturing processes.
W632GU6NB09I TR Features
- High Clock Frequency: Operates at 1.066 GHz, ensuring fast data processing.
- Low Power Consumption: Functions within a voltage range of 1.283V to 1.45V.
- High-Speed Access: Achieves an access time of 20 ns and a write cycle time of 15 ns.
- Large Memory Capacity: Provides a total memory size of 2Gbit with a 128M x 16 organization.
- Volatile DRAM: Retains data as long as power is supplied, ensuring data integrity.
- Parallel Memory Interface: Facilitates efficient data transfer and integration.
- Surface Mount Compatibility: Ideal for modern PCB designs with its 96VFBGA package.
- Environmental Compliance: REACH unaffected and RoHS3 compliant.
- Moisture Resistance: MSL 3 (168 hours) ensures reliability in various manufacturing conditions.
W632GU6NB09I TR Applications
The W632GU6NB09I TR is well-suited for applications requiring high-speed data processing and large memory capacity. Its low power consumption and high-speed access times make it ideal for:
- High-Performance Computing: Ideal for servers and workstations that require rapid data processing.
- Networking Equipment: Suitable for routers and switches where fast data transfer is critical.
- Consumer Electronics: Perfect for gaming consoles and high-end multimedia devices.
- Industrial Automation: Can be used in control systems and data acquisition devices.
- Telecommunications: Applicable in base stations and communication hubs.
Conclusion of W632GU6NB09I TR
The W632GU6NB09I TR from Winbond Electronics Corporation stands out as a reliable and high-performance DRAM memory IC chip. Its combination of high clock frequency, low power consumption, and fast access times make it a superior choice for applications demanding rapid data processing and large memory capacity. The chip's compliance with environmental standards and its robust moisture resistance further enhance its appeal. Whether used in high-performance computing, networking, or consumer electronics, the W632GU6NB09I TR delivers exceptional performance and reliability.



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