Winbond Electronics Corporation_W632GU6NB12I TR
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Winbond Electronics Corporation
W632GU6NB12I TR

774-W632GU6NB12I TR
PDF Datasheet
IC DRAM 2GBIT PARALLEL 96VFBGA
22 Weeks

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Obsolete
HTS
8542.32.00.36
Automotive
No
PPAP
No
DRAM Type
DDR3L SDRAM
Chip Density (bit)
2G
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W632GU6NB12I TR Description

W632GU6NB12I TR Description

The W632GU6NB12I TR is a high-performance DRAM memory IC designed for demanding applications requiring fast access times and reliable performance. Manufactured by Winbond Electronics Corporation, this memory IC features a clock frequency of 800 MHz, ensuring rapid data processing and efficient operation. The memory is organized as 128M x 16, providing a total memory size of 2 Gbit, which is ideal for applications needing substantial memory capacity.

This DRAM IC operates within a supply voltage range of 1.283V to 1.45V, making it suitable for low-power applications while maintaining high performance. The access time of 20 ns and write cycle time of 15 ns for word and page operations ensure that data can be read and written quickly, minimizing latency and enhancing overall system efficiency.

The W632GU6NB12I TR is packaged in a 96VFBGA format and is available in a Tape & Reel (TR) package type, which is ideal for surface mount applications. This packaging ensures ease of integration into modern electronic systems and supports automated assembly processes.

W632GU6NB12I TR Features

  • High Clock Frequency: The 800 MHz clock frequency enables fast data processing and high-speed operation, making it suitable for applications requiring rapid data access.
  • Low Access Time: With an access time of 20 ns, this DRAM IC ensures minimal latency, allowing for efficient data retrieval and enhanced system performance.
  • Low Power Consumption: Operating within a voltage range of 1.283V to 1.45V, this memory IC is designed for low-power applications, reducing energy consumption without compromising performance.
  • Robust Memory Organization: The 128M x 16 memory organization provides a total memory size of 2 Gbit, offering substantial capacity for data storage and processing.
  • Fast Write Cycle Time: The write cycle time of 15 ns ensures quick data writing, further enhancing the overall efficiency of the memory IC.
  • Surface Mount Compatibility: The 96VFBGA package format and Tape & Reel (TR) packaging type make it ideal for surface mount applications, supporting automated assembly processes and ensuring ease of integration.
  • Compliance and Reliability: The W632GU6NB12I TR is REACH unaffected and RoHS3 compliant, ensuring environmental and safety standards are met. Additionally, its moisture sensitivity level (MSL) of 3 (168 hours) ensures reliability in various environmental conditions.

W632GU6NB12I TR Applications

The W632GU6NB12I TR is well-suited for a variety of high-performance applications, including:

  • Networking Equipment: Ideal for routers, switches, and other networking devices that require fast data processing and low latency.
  • Telecommunications: Suitable for base stations and other telecommunication equipment where high-speed data access and reliable performance are critical.
  • Industrial Control Systems: Applicable in industrial automation and control systems that demand robust memory solutions with fast access times.
  • Embedded Systems: Perfect for embedded systems in various industries, including automotive, aerospace, and consumer electronics, where low power consumption and high performance are essential.

Conclusion of W632GU6NB12I TR

The W632GU6NB12I TR from Winbond Electronics Corporation is a high-performance DRAM memory IC that offers a unique combination of fast access times, low power consumption, and substantial memory capacity. Its 800 MHz clock frequency, 20 ns access time, and 15 ns write cycle time make it an ideal choice for applications requiring rapid data processing and low latency. The 128M x 16 memory organization and 2 Gbit memory size provide ample capacity for data storage and processing, while the 1.283V to 1.45V supply voltage range ensures energy efficiency.

With its 96VFBGA package format and Tape & Reel (TR) packaging type, the W632GU6NB12I TR is designed for surface mount applications, supporting automated assembly processes and ensuring ease of integration into modern electronic systems. Compliance with REACH and RoHS3 standards, along with a moisture sensitivity level of 3 (168 hours), ensures reliability and environmental safety.

Overall, the W632GU6NB12I TR is a reliable and efficient memory solution, ideal for networking equipment, telecommunications, industrial control systems, and embedded systems. Its unique features and advantages make it a standout choice in the competitive market of memory ICs.

FAQ

What package or case is W632GU6NB12I TR available in?
W632GU6NB12I TR is available in the 0.6(Max) mm package / case.
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