Winbond Electronics Corporation_W66BP6NBHAHJ
original

Winbond Electronics Corporation
W66BP6NBHAHJ

774-W66BP6NBHAHJ
PDF Datasheet
2GB LPDDR4, X16, 2133MHZ, -40C~1
16 Weeks

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original
D&B

Tech Specifications

EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
LTB
HTS
EA
Automotive
No
PPAP
No
Mounting
Surface Mount
Package Height
0.62
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W66BP6NBHAHJ Description

SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 2.133 GHz 3.6 ns 100-VFBGA (10x7.5)

FAQ

What is the mounting type of W66BP6NBHAHJ?
W66BP6NBHAHJ uses a Surface Mount mounting style based on the listed product specifications.
Does W66BP6NBHAHJ have quantity-based pricing?
Are there related or alternative parts for W66BP6NBHAHJ?
What is W66BP6NBHAHJ?
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