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Winbond Electronics Corporation
W66CL2NQUAFI
774-W66CL2NQUAFI
PDF Datasheet
DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin WFBGA
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Tech Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Obsolete
HTS
8542.32.00.36
Automotive
No
PPAP
No
DRAM Type
Mobile LPDDR4 SDRAM
Chip Density (bit)
4G
W66CL2NQUAFI Description
DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin WFBGA
FAQ
What operating temperature range does W66CL2NQUAFI support?
W66CL2NQUAFI has an operating temperature range of -40.
What is the mounting type of W66CL2NQUAFI?
What package or case is W66CL2NQUAFI available in?
What is the standard lead time for W66CL2NQUAFI?
Are there related or alternative parts for W66CL2NQUAFI?
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