Winbond Electronics Corporation
W66CQ2NQUAGJ TR

774-W66CQ2NQUAGJ TR
PDF Datasheet
IC DRAM 4GBIT LVSTL 11 200WFBGA
28 Weeks

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

ECCN (US)
EAR99
Part Status
Active
HTS
EA
DRAM Type
Mobile LPDDR4X SDRAM
Chip Density (bit)
4G
Organization
128Mx32
Number of Internal Banks
8
Number of Words per Bank
16M
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W66CQ2NQUAGJ TR Description

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.866 GHz 3.5 ns 200-WFBGA (10x14.5)

FAQ

What operating temperature range does W66CQ2NQUAGJ TR support?
W66CQ2NQUAGJ TR has an operating temperature range of -40.
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What is W66CQ2NQUAGJ TR?
Is W66CQ2NQUAGJ TR currently in stock?
Does W66CQ2NQUAGJ TR have quantity-based pricing?
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