XMOS_XLF232-1024-FB374-C40
original

XMOS
XLF232-1024-FB374-C40

685-XLF232-1024-FB374-C40
PDF Datasheet
IC MCU 32BIT 2MB FLASH 374FBGA

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Tech Specifications

Core Processor
XCore
Program Memory Type
FLASH
Product Status
Obsolete
Supplier Device Package
374-FBGA (18x18)
EEPROM Size
-
Package / Case
374-LFBGA
REACH Status
REACH Unaffected
Mfr
XMOS
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XLF232-1024-FB374-C40 Description

The XLF232-1024-FB374-C40 is a high-performance, low-power FPGA (Field Programmable Gate Array) module developed by XMOS. This module is designed to provide a flexible and customizable solution for various applications, including industrial control, IoT (Internet of Things) devices, and communication systems.

Description:

The XLF232-1024-FB374-C40 is a compact and versatile FPGA module that features a Xilinx Artix-7 FPGA chip with 232 I/O pins and 1024 logic cells. The module is housed in a 374-pin fine-pitch ball grid array (FBGA) package, making it suitable for high-density applications.

Features:

  1. Xilinx Artix-7 FPGA chip: The module is built around a powerful Xilinx Artix-7 FPGA chip, which offers a wide range of features and capabilities, including advanced digital signal processing, high-speed data conversion, and flexible I/O options.
  2. 232 I/O pins: The module provides a large number of I/O pins, allowing for extensive connectivity and interfacing options.
  3. 1024 logic cells: The module offers a high-density logic cell count, enabling complex designs and applications.
  4. Low power consumption: The XLF232-1024-FB374-C40 is designed to operate with low power consumption, making it suitable for energy-efficient applications.
  5. High-density packaging: The 374-pin fine-pitch ball grid array (FBGA) package allows for high-density integration in compact spaces.
  6. Customizable design: The module can be customized to meet specific application requirements, providing a flexible solution for various industries.

Applications:

  1. Industrial control: The XLF232-1024-FB374-C40 can be used in industrial control systems for tasks such as motor control, sensor interfacing, and data acquisition.
  2. IoT devices: The module's low power consumption and flexible I/O options make it suitable for IoT devices, enabling the development of smart home appliances, wearable devices, and other connected devices.
  3. Communication systems: The XLF232-1024-FB374-C40 can be used in communication systems for tasks such as signal processing, data conversion, and interface management.
  4. Embedded systems: The module can be integrated into embedded systems for various applications, including automotive, aerospace, and medical devices.
  5. Custom applications: The customizable nature of the XLF232-1024-FB374-C40 allows it to be used in a wide range of custom applications, tailored to specific industry needs and requirements.

FAQ

What is the mounting type of XLF232-1024-FB374-C40?
XLF232-1024-FB374-C40 uses a Surface Mount mounting style based on the listed product specifications.
What is XLF232-1024-FB374-C40?
What package or case is XLF232-1024-FB374-C40 available in?
What operating temperature range does XLF232-1024-FB374-C40 support?
Are there related or alternative parts for XLF232-1024-FB374-C40?
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