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TC164-FR-071K74L

TC164-FR-071K74L Description

The TC164-FR-071K74L from YAGEO is a high-performance 4-resistor network designed for precision surface-mount applications. This 1206 (3216 Metric) concave long-side terminal package offers a compact footprint of 3.20mm x 1.60mm (0.126" x 0.063") with a low-profile height of 0.70mm (0.028"), making it ideal for space-constrained PCB designs. Each resistor in the array features a 1.74kΩ resistance with a tight ±1% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The isolated circuit configuration allows for independent resistor operation, while the 62.5mW power rating per element ensures reliable operation in low-power circuits.

TC164-FR-071K74L Features

• 4 isolated resistors in a single 1206 package, reducing board space and assembly complexity.
• High precision: ±1% tolerance and ±200ppm/°C TCR for consistent performance.
• Compact design: Concave long-side terminals enhance solder joint reliability.
• RoHS3 & REACH compliant, meeting stringent environmental regulations.
• MSL 1 (Unlimited): Suitable for extended storage and handling without moisture sensitivity concerns.
• Tape & Reel (TR) packaging for automated assembly efficiency.
• Wide operating range: Ideal for industrial, automotive, and consumer electronics.

TC164-FR-071K74L Applications

This resistor network excels in applications requiring precision resistance matching and space savings, such as:

• Voltage dividers in sensor interfaces and ADC circuits.
• Pull-up/pull-down networks in digital logic systems.
• Signal conditioning for IoT devices and wearables.
• Impedance matching in RF and communication modules.
• Power management circuits in portable electronics.

Conclusion of TC164-FR-071K74L

The TC164-FR-071K74L combines miniaturization, precision, and reliability, making it a superior choice for modern electronics. Its isolated design, robust construction, and compliance with industry standards ensure versatility across automotive, industrial, and consumer applications. Engineers benefit from reduced BOM complexity and improved signal integrity, solidifying its position as a go-to solution for high-density PCB designs.