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YC158TJR-07150KL

YC158TJR-07150KL Description

The YC158TJR-07150KL is a high-performance 8-resistor bussed network from YAGEO's YC158T series, designed for precision and reliability in compact surface-mount applications. This 1206 (3216 Metric) convex package features long-side terminals for improved mechanical stability and solderability. With a 150kΩ resistance per element (±5% tolerance) and a ±200ppm/°C temperature coefficient, it delivers stable performance across varying environmental conditions. The array operates at 62.5mW power per resistor and is RoHS3 compliant, meeting stringent environmental standards. Its low-profile design (0.028" seated height) and tape & reel packaging make it ideal for automated assembly processes.

YC158TJR-07150KL Features

• 8-resistor bussed network in a compact 1206 (3.20mm x 1.60mm) footprint.
• 150kΩ resistance with ±5% tolerance for balanced signal distribution.
• ±200ppm/°C temperature coefficient ensures stability in thermal variations.
• 62.5mW power rating per element, suitable for low-power digital circuits.
• Convex, long-side terminal design enhances solder joint reliability.
• MSL 1 (Unlimited) moisture sensitivity, allowing extended floor life.
• REACH unaffected and ROHS3 compliant for environmentally conscious designs.
• Optimized for DDRAM/SDRAM applications due to precise impedance matching.

YC158TJR-07150KL Applications

This resistor array excels in high-density PCB designs requiring consistent resistance values, such as:

• Memory modules (DDRAM, SDRAM) for termination and pull-up/pull-down networks.
• Digital signal processing (DSP) systems where space-saving components are critical.
• Consumer electronics (e.g., smartphones, tablets) due to its low-profile and reliability.
• Industrial control systems demanding stable performance under thermal stress.
• Automotive electronics where RoHS compliance and durability are prioritized.

Conclusion of YC158TJR-07150KL

The YC158TJR-07150KL combines miniaturization, precision, and robustness, making it a standout choice for modern electronics. Its bussed architecture simplifies circuit design, while the 1206 package balances space efficiency and manufacturability. Ideal for memory and digital systems, this array meets the demands of high-reliability applications while adhering to global environmental standards. Engineers benefit from its thermal stability, ease of assembly, and proven performance in mission-critical designs.