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YC158TJR-071K1L

YC158TJR-071K1L Description

The YC158TJR-071K1L from YAGEO is a high-performance 8-resistor bussed network designed for precision surface-mount applications. Encased in a compact 1206 (3216 Metric) convex package with long-side terminals, this device offers a 1.1kΩ resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient. Its 62.5mW power rating per resistor ensures reliable operation in demanding circuits. The 0.028" (0.70mm) low-profile seated height and 3.20mm x 1.60mm footprint make it ideal for space-constrained designs. Compliant with ROHS3 and REACH standards, it is packaged in Tape & Reel (TR) for automated assembly efficiency.

YC158TJR-071K1L Features

• 8-resistor bussed array simplifies circuit design and reduces component count.
• 1206 convex package with long-side terminals enhances mechanical stability and solderability.
• ±200ppm/°C TCR ensures stable performance across temperature variations.
• 62.5mW power dissipation per element supports robust operation in high-density layouts.
• Moisture Sensitivity Level (MSL) 1 allows unlimited floor life, eliminating baking requirements.
• ROHS3 and REACH compliant, meeting stringent environmental regulations.

YC158TJR-071K1L Applications

This resistor network excels in DDRAM and SDRAM memory modules, where consistent impedance and compact form factors are critical. It is also suited for:

• Voltage divider networks in power management ICs.
• Pull-up/pull-down resistor arrays in digital logic circuits.
• Signal conditioning in communication interfaces.
• Automotive and industrial electronics requiring high reliability under thermal stress.

Conclusion of YC158TJR-071K1L

The YC158TJR-071K1L combines space efficiency, stability, and ease of integration, making it a superior choice for modern electronics. Its bussed architecture, low-profile design, and compliance with environmental standards position it as a versatile solution for memory systems, power management, and signal processing applications. Engineers benefit from its reduced BOM complexity and automated assembly compatibility, streamlining production workflows.