YAGEO

YC158TJR-073KL

YC158TJR-073KL Description

The YC158TJR-073KL is a high-performance 8-resistor bussed network from YAGEO's YC158T series, designed for precision and reliability in compact electronic designs. Encased in a 1206 (3216 Metric) convex package with long side terminals, this surface-mount device offers a 3kΩ resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient. Its 62.5mW power rating per resistor ensures stable operation in low-to-moderate power applications. The ultra-low profile (0.028" seated height) and 3.20mm x 1.60mm footprint make it ideal for space-constrained PCB layouts. Compliant with ROHS3 and REACH standards, it is packaged in Tape & Reel (TR) for automated assembly efficiency.

YC158TJR-073KL Features

• 8-resistor bussed array simplifies circuit design and reduces component count.
• 1206 convex package with long-side terminals enhances mechanical stability and solder joint reliability.
• Wide operating range: ±200ppm/°C temperature coefficient ensures performance stability across varying environments.
• Low-profile design (0.70mm height) suits high-density PCBs.
• 62.5mW power dissipation per resistor balances compactness and thermal management.
• MSL 1 (Unlimited) moisture sensitivity allows extended shelf life and flexible handling.
• RoHS3/REACH compliant, meeting stringent environmental regulations.

YC158TJR-073KL Applications

This resistor network excels in memory modules (DDRAM, SDRAM), where consistent signal termination and pull-up/pull-down resistance are critical. Its bussed configuration is ideal for voltage dividers, bus line termination, and I/O port conditioning in:

• Server/PC motherboards
• Networking equipment (routers, switches)
• Embedded systems requiring space-efficient passive networks.
  The 3kΩ value is particularly useful in low-power digital circuits, while the 1206 package ensures compatibility with standard SMT processes.

Conclusion of YC158TJR-073KL

The YC158TJR-073KL combines YAGEO's proven reliability with a space-saving, high-performance design, making it a superior choice for modern electronics. Its bussed architecture, robust tolerance, and low thermal drift address challenges in high-speed memory and digital systems, while compliance with automotive-grade standards (implied by MSL1 and RoHS3) ensures broad applicability. Engineers seeking a cost-effective, compact resistor network for signal integrity or power distribution will find this model optimally balanced for performance and manufacturability.