YAGEO

YC324-FK-07100RL

YC324-FK-07100RL Description

The YC324-FK-07100RL from YAGEO is a high-performance 4-resistor array designed for surface-mount applications. This 2012 (0805 metric) convex, long-side terminal package offers a compact footprint of 0.200" x 0.126" (5.08mm x 3.20mm) with a low-profile height of 0.028" (0.70mm), making it ideal for space-constrained PCB designs. Each resistor in the array features a 100-ohm resistance with a tight ±1% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The isolated circuit configuration allows for independent resistor operation, enhancing design flexibility.

YC324-FK-07100RL Features

• 4 isolated resistors in a single 8-pin package, reducing component count and PCB footprint.
• 125mW power rating per element, suitable for low-power signal conditioning and voltage division.
• ROHS3 compliant and REACH unaffected, meeting stringent environmental regulations.
• Moisture Sensitivity Level (MSL) 1, ensuring reliability in humid conditions without requiring baking.
• Tape & Reel (TR) packaging, optimized for automated assembly processes.
• Wide operating temperature range and low TCR (±200ppm/°C), ensuring stability in industrial and automotive applications.

YC324-FK-07100RL Applications

This resistor array excels in precision analog circuits, sensor interfaces, and voltage divider networks. Its compact size and high reliability make it ideal for:

• Consumer electronics: Signal conditioning in wearables, smartphones, and IoT devices.
• Automotive systems: Sensor calibration, ECU signal processing, and infotainment systems.
• Industrial controls: PLCs, instrumentation, and feedback loop circuits.
• Medical devices: Low-noise signal amplification and filtering.

Conclusion of YC324-FK-07100RL

The YC324-FK-07100RL combines miniaturization, precision, and reliability, making it a superior choice for modern electronics. Its isolated resistor design, robust construction, and compliance with environmental standards position it as a versatile solution for high-density PCB layouts. Engineers can leverage its low TCR, tight tolerance, and automated assembly compatibility to enhance performance in demanding applications while reducing BOM complexity.