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YC324-FK-075K6L

YC324-FK-075K6L Description

The YC324-FK-075K6L from YAGEO is a high-performance 4-resistor network designed for precision surface-mount applications. This 2012 (0805 metric) convex long-side terminal package features isolated resistors with a 5.6kΩ resistance and a tight ±1% tolerance, ensuring reliable performance in demanding circuits. With a ±200ppm/°C temperature coefficient, it maintains stability across varying thermal conditions. The compact 0.200" x 0.126" (5.08mm x 3.20mm) footprint and 0.028" (0.70mm) profile make it ideal for space-constrained designs. Compliant with ROHS3 and REACH standards, it is supplied in Tape & Reel (TR) packaging for automated assembly efficiency.

YC324-FK-075K6L Features

• Precision Resistance: 5.6kΩ ±1% tolerance for accurate signal conditioning.
• Robust Construction: 2012 convex package with long-side terminals enhances mechanical stability.
• Thermal Reliability: ±200ppm/°C coefficient ensures minimal drift in high-temperature environments.
• High Power Handling: 125mW power rating per element for sustained performance.
• Automation-Friendly: Tape & Reel packaging supports high-volume PCB assembly.
• Compliance: Meets ROHS3, REACH, and MSL1 (Unlimited) standards for global usability.

YC324-FK-075K6L Applications

This resistor array excels in:

• Analog Signal Processing: Voltage dividers, pull-up/pull-down networks in IoT devices.
• Consumer Electronics: Dense PCBs in smartphones, wearables, and audio equipment.
• Industrial Controls: Precision instrumentation, sensor calibration circuits.
• Automotive Electronics: ECU modules where thermal stability is critical.
• Power Management: Feedback networks in DC-DC converters.

Conclusion of YC324-FK-075K6L

The YC324-FK-075K6L combines miniaturization, precision, and thermal resilience, making it a superior choice for modern electronics. Its isolated circuit design and automation-ready packaging streamline production, while YAGEO's quality assurance guarantees long-term reliability. Ideal for engineers prioritizing space efficiency and performance in high-density, temperature-variable applications.