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YC358LJK-0718KL

YC358LJK-0718KL Description

The YC358LJK-0718KL from YAGEO is an 8-resistor bussed network array designed for high-density PCB applications. Housed in a compact 2512 (6432 Metric) convex package with long-side terminals, it offers a 18kΩ resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. The device operates at 62.5mW power per element and features a low-profile 0.028" (0.70mm) seated height, making it suitable for space-constrained designs. Compliant with ROHS3 and REACH standards, it is delivered in Tape & Reel (TR) packaging for automated assembly. Its Moisture Sensitivity Level (MSL) 1 rating ensures reliability in varied environmental conditions.

YC358LJK-0718KL Features

• High Integration: 8-resistor bussed network in a single 2512 package reduces board space and simplifies routing.
• Stable Performance: ±200ppm/°C temperature coefficient ensures consistent operation across industrial temperature ranges.
• Robust Construction: Convex, long-side terminal design enhances mechanical stability and solder joint reliability.
• Industry Compliance: Meets ROHS3, REACH, and EAR99 standards for global deployment.
• Automation-Friendly: Supplied in Tape & Reel (TR) for high-speed pick-and-place assembly.

YC358LJK-0718KL Applications

• Memory Modules: Ideal for DDRAM and SDRAM termination and pull-up/pull-down circuits due to its precise resistance matching.
• Power Management: Used in voltage divider networks and current-limiting applications in power supplies.
• Consumer Electronics: Suitable for compact devices like smartphones and tablets where space efficiency is critical.
• Industrial Controls: Reliable performance in harsh environments, including automotive and IoT edge devices.

Conclusion of YC358LJK-0718KL

The YC358LJK-0718KL resistor array combines high density, stability, and manufacturability, making it a superior choice for modern electronics. Its low-profile design, robust tolerance, and compliance with environmental standards position it as a versatile solution for memory, power, and consumer applications. Engineers benefit from its simplified BOM consolidation and reduced assembly costs, ensuring both performance and cost efficiency in high-volume production.