DA14535MOD

The DA14535MOD is a highly integrated Bluetooth Low Energy (BLE) system-on-chip (SoC) developed by Renesas Electronics Corporation, designed for low-power wireless applications. It features an ARM Cortex-M0 processor running at up to 32 MHz, providing efficient processing capabilities while maintaining minimal power consumption—critical for battery-powered devices. The SoC includes 512 KB of flash memory and 64 KB of SRAM, enabling robust firmware storage and real-time data handling for complex BLE protocols. This device supports the latest Bluetooth 5.0 specification, offering extended range, higher data rates, and improved coexistence with other wireless technologies like Wi-Fi. Its advanced radio performance ensures reliable connectivity in challenging RF environments, making it ideal for smart home, industrial IoT, and wearable applications. The DA14535MOD also includes a built-in RF front-end, eliminating the need for external components and reducing overall system cost and complexity. Key features include a low-noise amplifier (LNA), high-performance synthesizer, and integrated power management unit (PMU) that enables dynamic voltage scaling and ultra-low power modes such as deep sleep with sub-1 μA current draw. The chip integrates multiple peripherals including UART, SPI, I²C, and GPIOs, supporting flexible interfacing with sensors, displays, and other external modules. A dedicated hardware crypto engine provides secure communication through AES-128 encryption and secure boot functionality. Designed for ease of development, the DA14535MOD comes with a comprehensive software stack, including the Renesas BLE Host Stack and Device Firmware Upgrade (DFU) support, allowing developers to rapidly prototype and deploy secure, scalable solutions. The module supports both host-based and standalone operation modes, offering flexibility in system architecture design. Applications for this SoC span across smart lighting, asset tracking, medical devices, remote controls, and consumer electronics where long battery life, small form factor, and reliable wireless connectivity are essential. Its compact 7x7 mm QFN package makes it suitable for space-constrained designs, while its proven reliability in harsh environments ensures durable performance in industrial and outdoor settings.