Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
Part # | Manufacturer | Description | Availability | Pricing | Quantity |
---|---|---|---|---|---|
![]() HSS15-B20-P40Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 23. | 4826 | 1+: $0.82760 10+: $0.77892 100+: $0.70589 1000+: $0.68155 | |
![]() HSB13-303014Heat Sinks | CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 | 390 | 1+: $1.08272 10+: $1.01504 100+: $0.94738 1000+: $0.91354 | |
![]() HSB03-141406Heat Sinks | CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM | 931 | 1+: $0.60096 10+: $0.56560 100+: $0.51258 1000+: $0.49490 | |
![]() HSB15-404010Heat Sinks | CUI Devices | HEAT SINK, BGA, 40 X 40 X 10 MM | 931 | 1+: $1.26696 10+: $1.18776 100+: $1.10858 1000+: $1.06898 | |
![]() HSB05-171711Heat Sinks | CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M | 1865 | 1+: $0.86456 10+: $0.81052 100+: $0.75649 1000+: $0.72947 | |
![]() HSB09-212115Heat Sinks | CUI Devices | HEAT SINK, BGA, 21 X 21 X 15 MM | In Stock | 1+: $0.75032 10+: $0.70620 100+: $0.63999 1000+: $0.61792 | |
![]() HSB08-212106Heat Sinks | CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM | 1566 | 1+: $0.71772 10+: $0.67548 100+: $0.61216 1000+: $0.59105 | |
![]() HSS11-B20-P38Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 50. | 2150 | 1+: $0.81216 10+: $0.76436 100+: $0.69271 1000+: $0.66882 | |
![]() HSS08-B18-CPHeat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218, 44. | 984 | 1+: $1.62104 10+: $1.56702 100+: $1.40491 1000+: $1.37789 | |
![]() HSB01-080808Heat Sinks | CUI Devices | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM | 1866 | 1+: $0.59408 10+: $0.55914 100+: $0.50672 1000+: $0.48924 | |
![]() HSS07-C20-P274Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 21. | 2297 | 1+: $1.07304 10+: $1.00596 100+: $0.93890 1000+: $0.90536 | |
![]() HSB12-272706Heat Sinks | CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM | 1293 | 1+: $0.71772 10+: $0.67548 100+: $0.61216 1000+: $0.59105 | |
![]() HSS06-C20-P32Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 27. | 358 | 1+: $1.17968 10+: $1.10596 100+: $1.03222 1000+: $0.99536 | |
![]() HSB06-181810Heat Sinks | CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM | 1980 | 1+: $0.81284 10+: $0.76204 100+: $0.71124 1000+: $0.68584 | |
![]() HSB20-353525Heat Sinks | CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM | 560 | 1+: $1.56348 10+: $1.51136 100+: $1.35502 1000+: $1.32896 | |
![]() HSB02-101007Heat Sinks | CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM | 3079 | 1+: $0.54256 10+: $0.51066 100+: $0.46278 1000+: $0.44682 | |
![]() HSB19-272718Heat Sinks | CUI Devices | HEAT SINK, BGA, 27 X 27 X 18 MM | 518 | 1+: $1.54004 10+: $1.44380 100+: $1.34754 1000+: $1.29942 | |
![]() HSS10-B20-P40Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 29. | 1675 | 1+: $0.72800 10+: $0.68518 100+: $0.62095 1000+: $0.59954 | |
![]() HSB07-202009Heat Sinks | CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM | 3 | 1+: $0.68164 10+: $0.64156 100+: $0.58141 1000+: $0.56136 | |
![]() HSS12-B20-P95Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 19 | In Stock | 1+: $0.87264 | |
![]() 114992731Heat Sinks | Seeed | ALUMINUM HEATSINK WITH FAN FOR J | 103 | 1+: $22.38000 | |
![]() IW-HSKALU-CLASLR-SC04Heat Sinks | iWave Systems | I.MX 8MPLUS SMARC SOM HEATSINK | 50 | 1+: $29.40000 | |
![]() IW-HSKALU-CLASLR-SB04Heat Sinks | iWave Systems | I.MX 8MMINI SBC HEATSINK | 3 | 1+: $30.00000 | |
![]() IW-HSKALU-CLASLR-Q70BHeat Sinks | iWave Systems | I.MX 8MMINI/NANO UQ7 HEATSINK | 2 | 1+: $23.20000 | |
![]() IW-HSKALU-CLASLR-SS05Heat Sinks | iWave Systems | I.MX 8MMINI/NANO SODIMM HEATSINK | 150 | 1+: $23.20000 |