Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
HS-2200-F1Heat Sinks | Arbor Technology | Heat Sinks Heat Spreader (70*65*8mm) for EmQ-i2200 / EmQ-i2205 | In Stock | - | |
HS-250C-F2Heat Sinks | Arbor Technology | Heat Sinks Heatspreader for EmETXe-i250C/i2503 | In Stock | - | |
HS-89M0-F1Heat Sinks | Arbor Technology | Heat Sinks Heat Spreader (125*95*18mm) for EmETXe-i89M0/89M3 | In Stock | - |