Heat Sinks

(10 results)

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.

Part # Manufacturer Description Availability Pricing Quantity
TechNexion_PICOHEATSINKKIT

PICOHEATSINKKIT

Heat Sinks
TechNexion PICO HEATSINK + THERMAL PAD + SC
In Stock
-
TechNexion_EDMHSCP12201001

EDMHSCP12201001

Heat Sinks
TechNexion Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
In Stock
-
TechNexion Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
In Stock
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TechNexion Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
In Stock
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TechNexion Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
In Stock
-
TechNexion Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
In Stock
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TechNexion Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
In Stock
-
TechNexion Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
In Stock
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TechNexion Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
In Stock
-
TechNexion_WB-HS

WB-HS

Heat Sinks
TechNexion Heat Sinks WANDBOARD HEATSINK
5
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