AMD

XC17V02PC44C

XC17V02PC44C Description

The XC17V02PC44C is a 2Mb OTP (One-Time Programmable) PROM from AMD, designed for use in FPGA (Field-Programmable Gate Array) configuration memory applications. This surface-mount device operates within a voltage range of 3V to 3.6V and has an operating temperature range of 0°C to 70°C. It is packaged in a 44-pin PLCC (Plastic Leaded Chip Carrier) tube, making it suitable for a variety of electronic systems.

XC17V02PC44C Features

• Memory Size: 2Mb, providing ample space for storing configuration data for FPGAs.
• Voltage - Supply: 3V to 3.6V, ensuring compatibility with a wide range of power supply systems.
• Operating Temperature: 0°C to 70°C, allowing for use in various environmental conditions.
• Programmable Type: OTP, offering a cost-effective solution for applications where reprogramming is not required.
• Mounting Type: Surface Mount, facilitating integration into modern electronic devices.
• Package: 44-pin PLCC tube, providing a compact and reliable packaging option.
• Moisture Sensitivity Level (MSL): 3 (168 Hours), indicating that the device can withstand exposure to moisture for up to 168 hours before baking is required.

XC17V02PC44C Applications

The XC17V02PC44C is ideal for applications where a reliable and cost-effective solution for FPGA configuration memory is required. Some specific use cases include:

1. Industrial Automation: In control systems and automation equipment, where the device's ability to withstand a wide temperature range and resist moisture is crucial.
2. Telecommunications: For storing configuration data in communication devices, benefiting from the device's OTP programming and reliable performance.
3. Automotive Electronics: In vehicle control systems and infotainment systems, where the device's temperature range and moisture resistance are advantageous.

Conclusion of XC17V02PC44C

The XC17V02PC44C from AMD is a robust and reliable OTP PROM designed for FPGA configuration memory applications. Its 2Mb memory size, wide operating temperature range, and surface-mount packaging make it a versatile choice for a variety of electronic systems. While it is now considered obsolete, its unique features and advantages make it suitable for legacy systems and specific applications where such a device is required.