AMD_XC3S1000-4FGG456C
original

AMD
XC3S1000-4FGG456C

696-XC3S1000-4FGG456C
IC FPGA 333 I/O 456FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
442368
Number of LABs/CLBs
1920
ECCN
3A991D
Number of I/O
333
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
456-FBGA (23x23)
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XC3S1000-4FGG456C Description

The XC3S1000-4FGG456C is a Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). It belongs to the Spartan-3 series of FPGAs, which are known for their low cost, low power consumption, and small form factor, making them suitable for a wide range of applications.

Description:

The XC3S1000-4FGG456C is a mid-range FPGA device that features a high-density of programmable logic elements, making it suitable for a wide range of applications. It is available in a 4-layer Fine-Pitch Ball Grid Array (FBGA) package, which provides a compact form factor and high-density interconnect for easy integration into a variety of systems.

Features:

  1. High-density programmable logic elements: The XC3S1000-4FGG456C features a high-density of programmable logic elements, which can be configured to implement a wide range of digital logic functions.
  2. Low power consumption: The Spartan-3 series of FPGAs are designed to operate at low power levels, making them suitable for battery-powered or energy-sensitive applications.
  3. Small form factor: The 4-layer FBGA package provides a compact form factor, making it easy to integrate the XC3S1000-4FGG456C into a variety of systems.
  4. Wide range of I/O options: The XC3S1000-4FGG456C features a wide range of I/O options, including LVCMOS, LVDS, and DiffPair, making it suitable for a variety of interface requirements.
  5. On-chip memory: The XC3S1000-4FGG456C includes on-chip memory resources, including block RAM and distributed RAM, which can be used to store data and implement complex logic functions.

Applications:

The XC3S1000-4FGG456C is suitable for a wide range of applications, including:

  1. Digital signal processing: The high-density of programmable logic elements and on-chip memory make the XC3S1000-4FGG456C well-suited for digital signal processing applications, such as audio and video processing.
  2. Industrial control: The low power consumption and small form factor make the XC3S1000-4FGG456C suitable for industrial control applications, such as motor control and sensor interfacing.
  3. Communications: The wide range of I/O options and low power consumption make the XC3S1000-4FGG456C suitable for communications applications, such as network routers and switches.
  4. Medical equipment: The low power consumption and small form factor make the XC3S1000-4FGG456C suitable for medical equipment, such as portable diagnostic devices and patient monitoring systems.
  5. Consumer electronics: The XC3S1000-4FGG456C can be used in a variety of consumer electronics applications, such as gaming consoles, set-top boxes, and smart home devices.

Overall, the XC3S1000-4FGG456C is a versatile FPGA device that offers a range of features and benefits, making it suitable for a wide range of applications.

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