The XC3S400-5FT256C is a field programmable gate array (FPGA) manufactured by AMD (now part of Xilinx). This device belongs to the Spartan-3 family of FPGAs, which are known for their low cost, low power consumption, and high integration density. The XC3S400-5FT256C is a mid-range device within the Spartan-3 family, offering a good balance between performance and cost.
Features:
Device Family: Spartan-3
Package Type: FinePitch Ball Grid Array (FBGA)
Package Density: 256-ball
I/O Count: 400
Programmable Logic: Contains a mix of configurable logic blocks (CLBs) and digital signal processing (DSP) blocks
Memory: Block RAM (BRAM) and distributed RAM
Clock Management: Dedicated clock management resources for precise clock control
Power Consumption: Low power operation suitable for battery-powered and portable applications
Operating Temperature Range: Commercial (0°C to 70°C) and industrial (-40°C to 85°C) temperature grades available
Configuration: In-system programmable (ISP) using serial or parallel configuration modes
Applications:
The XC3S400-5FT256C FPGA is suitable for a wide range of applications due to its versatile features and low power consumption. Some of the key application areas include:
Digital signal processing (DSP): Audio, video, and communication systems
Embedded systems: Control systems, human-machine interfaces (HMIs), and industrial automation
Networking: Ethernet switches, routers, and protocol converters
Automotive: Infotainment systems, body control modules, and engine control units
Consumer electronics: Set-top boxes, gaming consoles, and portable devices
Medical devices: Diagnostic equipment, monitoring systems, and portable medical instruments
Aerospace and defense: Radar systems, communication systems, and navigation equipment
Test and measurement: Signal generation, analysis, and data acquisition systems
The XC3S400-5FT256C is a versatile FPGA that can be customized to meet the specific requirements of various applications, making it a popular choice for engineers and designers in multiple industries.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
REACH Status
Mfr
Number of Gates
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XC3S400-5FT256C Documents
Download datasheets and manufacturer documentation for XC3S400-5FT256C
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service