AMD_XC3S500E-4FTG256I
original

AMD
XC3S500E-4FTG256I

696-XC3S500E-4FTG256I
IC FPGA 190 I/O 256FTBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
1164
ECCN
EAR99
Number of I/O
190
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S500E-4FTG256I Description

The XC3S500E-4FTG256I is a Field Programmable Gate Array (FPGA) device manufactured by AMD (now part of Xilinx). Here is a description of the model, its features, and potential applications:

Model Description:
The XC3S500E-4FTG256I is a member of the Spartan-3E family of FPGAs, which are designed for a wide range of applications requiring low power, high performance, and a small form factor. This particular model is a mid-range device with a moderate amount of logic elements and memory resources.

Features:

  1. Logic Elements: The XC3S500E-4FTG256I features a good number of configurable logic blocks (CLBs), which can be used to implement digital logic functions.
  2. Memory Resources: It includes Block RAM (BRAM) for storing data and implementing larger memory structures.
  3. I/O Pins: The device offers a variety of input/output (I/O) options, which can be configured for different types of interfaces such as LVDS, PCI Express, or simple CMOS.
  4. Speed Grade: The "-4" in the model number indicates a speed grade that offers a balance between performance and power consumption.
  5. Package Type: The "FTG256" refers to the package type, which is a FinePitch Ball Grid Array (FBGA) with 256 I/Os, suitable for applications where board space is limited.
  6. Temperature Range: The "I" in the model number denotes an industrial temperature range, making the device suitable for environments where temperature control is critical.
  7. Power Management: Spartan-3E FPGAs are designed with power efficiency in mind, making them suitable for battery-powered or energy-sensitive applications.

Applications:

  1. Embedded Systems: Due to their flexibility and moderate size, these FPGAs are well-suited for embedded systems where custom hardware can be implemented alongside a processor core.
  2. Communications: They can be used in communication systems that require high-speed data transfer and interface with various protocols.
  3. Industrial Control: The industrial temperature range makes the XC3S500E-4FTG256I suitable for control systems in harsh environments.
  4. Medical Electronics: The device can be used in medical equipment where reliability and precision are crucial.
  5. Automotive Systems: For applications within the automotive industry, particularly where low power and high reliability are required, such as in-vehicle networking or driver assistance systems.
  6. Aerospace and Defense: The industrial temperature rating also makes this FPGA suitable for aerospace and defense applications where components must operate under extreme conditions.

When using the XC3S500E-4FTG256I or any FPGA, it's important to consider the specific requirements of the application, including the necessary logic resources, I/O capabilities, power consumption, and environmental conditions. FPGAs are highly customizable, allowing designers to implement a wide range of digital systems and functions tailored to their specific needs.

FAQ

What operating temperature range does XC3S500E-4FTG256I support?
XC3S500E-4FTG256I has an operating temperature range of -40°C ~ 100°C (TJ).
What is the mounting type of XC3S500E-4FTG256I?
Are there related or alternative parts for XC3S500E-4FTG256I?
What package or case is XC3S500E-4FTG256I available in?
Does XC3S500E-4FTG256I have quantity-based pricing?
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