AMD_XC3S1200E-5FT256C
original

AMD
XC3S1200E-5FT256C

696-XC3S1200E-5FT256C
IC FPGA 190 I/O 256FTBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
516096
Number of LABs/CLBs
2168
ECCN
EAR99
Number of I/O
190
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S1200E-5FT256C Description

The XC3S1200E-5FT256C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-3E family of FPGAs, which are designed for a wide range of applications that require low power consumption, small form factors, and high performance.

Description:

The XC3S1200E-5FT256C is a mid-range FPGA device that offers a good balance between power consumption, performance, and cost. It features a high-density architecture, which allows for the implementation of complex digital circuits and systems. The device is available in a 256-ball fine pitch ball grid array (FBGA) package, making it suitable for use in a variety of applications where space is at a premium.

Features:

  1. Low power consumption: The Spartan-3E family of FPGAs is designed to operate at low voltages and low power, making it ideal for battery-powered and portable applications.
  2. High-performance logic cells: The XC3S1200E-5FT256C features high-performance logic cells that can be configured to implement a wide range of digital logic functions.
  3. On-chip memory: The device includes a variety of on-chip memory resources, including block RAM, distributed RAM, and register files, which can be used to implement memory-intensive applications.
  4. Digital signal processing (DSP) capabilities: The XC3S1200E-5FT256C includes dedicated DSP slices that can be used to implement complex signal processing algorithms.
  5. High-speed I/O: The device supports a wide range of high-speed I/O standards, including LVCMOS, LVDS, and GTP, making it suitable for use in high-speed communication and data transfer applications.
  6. Configurable I/O: The I/O pins of the XC3S1200E-5FT256C can be configured for a variety of functions, including general-purpose I/O, dedicated I/O, and specialized functions such as clock inputs and JTAG test access.

Applications:

The XC3S1200E-5FT256C is suitable for a wide range of applications that require low power consumption, small form factors, and high performance. Some potential applications include:

  1. Portable electronics: The low power consumption and small form factor of the XC3S1200E-5FT256C make it ideal for use in portable electronic devices, such as smartphones, tablets, and wearable devices.
  2. Embedded systems: The high-performance logic cells and configurable I/O of the XC3S1200E-5FT256C make it suitable for use in embedded systems, such as industrial control systems, automotive electronics, and medical devices.
  3. Communications: The high-speed I/O and DSP capabilities of the XC3S1200E-5FT256C make it suitable for use in communication systems, such as base stations, routers, and switches.
  4. Signal processing: The dedicated DSP slices and on-chip memory resources of the XC3S1200E-5FT256C make it suitable for use in signal processing applications, such as image and video processing, audio processing, and radar signal processing.
  5. Test and measurement: The XC3S1200E-5FT256C can be used in test and measurement equipment, such as oscilloscopes, spectrum analyzers, and logic analyzers, due to its high-performance logic cells and configurable I/O.

FAQ

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