AMD_XC3S1200E-4FGG400I
original

AMD
XC3S1200E-4FGG400I

696-XC3S1200E-4FGG400I
IC FPGA 304 I/O 400FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
516096
Number of LABs/CLBs
2168
ECCN
3A991D
Number of I/O
304
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
400-FBGA (21x21)
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XC3S1200E-4FGG400I Description

The XC3S1200E-4FGG400I is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3E series. This device is designed to provide a balance between performance, power consumption, and cost, making it an ideal choice for a wide range of applications.

Description:

The XC3S1200E-4FGG400I is an enhanced version of the Spartan-3E FPGA family, featuring a higher performance and lower power consumption compared to its predecessors. It is available in a 4-layer Fine-Pitch Ball Grid Array (FBGA) package with a total of 400 I/O pins.

Features:

  1. Advanced 90nm manufacturing process: This FPGA is built using a 90nm manufacturing process, which allows for higher performance and lower power consumption compared to older technologies.
  2. High-density architecture: The XC3S1200E-4FGG400I offers a high-density architecture, providing up to 1,200 configurable logic blocks (CLBs) and 16,000 system gates.
  3. Enhanced DSP capabilities: This FPGA features enhanced DSP capabilities, with dedicated multipliers and other DSP resources for improved signal processing performance.
  4. High-speed transceivers: The XC3S1200E-4FGG400I includes high-speed transceivers, supporting data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  5. Low-power design: The device features a low-power design, with power management features such as power-down modes and programmable clock domains to optimize power consumption.
  6. Robust I/O capabilities: The FPGA offers a wide range of I/O capabilities, including support for LVCMOS, LVDS, and other industry-standard I/O standards.
  7. On-chip memory: The XC3S1200E-4FGG400I includes on-chip memory resources, such as block RAM (BRAM) and distributed RAM, for efficient data storage and processing.

Applications:

The XC3S1200E-4FGG400I is suitable for a wide range of applications, including but not limited to:

  1. Communications: The high-speed transceivers and robust I/O capabilities make this FPGA ideal for communication systems, such as telecom, networking, and wireless applications.
  2. Industrial control: The device's high performance and low power consumption make it suitable for industrial control applications, such as motor control, robotics, and automation systems.
  3. Video processing: The enhanced DSP capabilities and on-chip memory resources make the XC3S1200E-4FGG400I well-suited for video processing applications, including image and video compression, decompression, and display processing.
  4. Automotive: The FPGA's robustness and reliability make it suitable for automotive applications, such as advanced driver assistance systems (ADAS), infotainment systems, and body control modules.
  5. Aerospace and defense: The XC3S1200E-4FGG400I can be used in aerospace and defense applications, such as radar processing, signal intelligence, and satellite communication systems.
  6. Medical electronics: The FPGA's performance and low power consumption make it suitable for medical electronics, such as imaging systems, patient monitoring, and diagnostic equipment.

In summary, the XC3S1200E-4FGG400I is a high-performance, low-power FPGA from Xilinx's Spartan-3E series, offering a wide range of features and capabilities that make it suitable for various applications across different industries.

FAQ

What package or case is XC3S1200E-4FGG400I available in?
XC3S1200E-4FGG400I is available in the 400-BGA package / case.
Are there related or alternative parts for XC3S1200E-4FGG400I?
What is XC3S1200E-4FGG400I?
Is XC3S1200E-4FGG400I currently in stock?
Does XC3S1200E-4FGG400I have quantity-based pricing?
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