AMD_XC3S1200E-5FGG400C
original

AMD
XC3S1200E-5FGG400C

696-XC3S1200E-5FGG400C
IC FPGA 304 I/O 400FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
516096
Number of LABs/CLBs
2168
ECCN
3A991D
Number of I/O
304
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
400-FBGA (21x21)
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XC3S1200E-5FGG400C Description

AMD XC3S1200E-5FGG400C is a field programmable gate array (FPGA) device that is part of the Xilinx Spartan-3E family. It is designed to provide high performance, low power, and high integration for a wide range of applications.

Description:

The XC3S1200E-5FGG400C is a mid-range FPGA device that offers a good balance between performance and cost. It features a high-density architecture and is available in a variety of package options, including the 5FGG400C package. This package is a flip-chip ball grid array (FCBGA) package that provides a high-density, low-profile solution for space-constrained applications.

Features:

  • High-performance, low-power architecture
  • High integration and logic density
  • Wide range of I/O options and capabilities
  • Support for a variety of protocols and standards
  • On-chip memory resources, including block RAM and distributed RAM
  • Digital signal processing (DSP) capabilities
  • Security features, including encryption and authentication

Applications:

The XC3S1200E-5FGG400C is suitable for a wide range of applications, including:

  • Communications and networking equipment
  • Industrial and automotive control systems
  • Consumer electronics, such as set-top boxes and gaming consoles
  • Aerospace and defense systems
  • Medical equipment and imaging systems
  • Security and surveillance systems

Overall, the AMD XC3S1200E-5FGG400C is a versatile FPGA device that offers a range of features and capabilities to meet the needs of various applications. Its high-performance, low-power architecture and high integration make it an ideal solution for space-constrained and power-sensitive applications.

FAQ

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