AMD_XC3S400-4FGG456C

AMD
XC3S400-4FGG456C  
FPGAs

AMD
XC3S400-4FGG456C
696-XC3S400-4FGG456C
IC FPGA 264 I/O 456FBGA
In Stock : 305

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XC3S400-4FGG456C Description

The XC3S400-4FGG456C is a field-programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is designed for a wide range of applications, including embedded systems, digital signal processing, and high-performance computing.

Description:

The XC3S400-4FGG456C is a member of the Spartan-3A family of FPGAs, which are known for their low power consumption, small form factor, and high performance. This device features a high-density architecture, with up to 400,000 logic cells and 180,000 system logic cells. It is available in a 456-pin fine-pitch ball grid array (FBGA) package.

Features:

  1. Low power consumption: The Spartan-3A family of FPGAs are designed for low power applications, making them ideal for battery-powered or energy-sensitive systems.
  2. High performance: The XC3S400-4FGG456C offers high-speed performance, with support for clock frequencies up to 400 MHz.
  3. Versatile I/O options: The device features a wide range of I/O options, including LVCMOS, LVDS, and LVTTL, making it suitable for various interface requirements.
  4. On-chip memory: The XC3S400-4FGG456C includes 16 Mbit of block RAM, which can be used for data storage, buffering, or other memory-intensive tasks.
  5. Security features: The device includes security features such as encryption and authentication, making it suitable for applications that require data protection.
  6. High-density architecture: With up to 400,000 logic cells and 180,000 system logic cells, the XC3S400-4FGG456C is well-suited for complex designs and high-density applications.

Applications:

  1. Embedded systems: The low power consumption and small form factor of the XC3S400-4FGG456C make it ideal for use in embedded systems, such as automotive control units, industrial automation, and consumer electronics.
  2. Digital signal processing: The high-performance capabilities of the device make it suitable for digital signal processing applications, such as audio processing, image processing, and communication systems.
  3. High-performance computing: The XC3S400-4FGG456C can be used in high-performance computing applications, such as data centers, cloud computing, and scientific research.
  4. Security systems: The security features of the device make it suitable for use in security systems, such as encryption and authentication applications.
  5. Telecommunications: The device's versatile I/O options and high-speed performance make it suitable for use in telecommunications equipment, such as routers, switches, and base stations.

In summary, the AMD XC3S400-4FGG456C is a high-performance, low-power FPGA device that offers a wide range of features and applications. Its high-density architecture, versatile I/O options, and security features make it suitable for a variety of applications, including embedded systems, digital signal processing, high-performance computing, security systems, and telecommunications.

Tech Specifications

Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
REACH Status
Mfr
Number of Gates
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers

XC3S400-4FGG456C Documents

Download datasheets and manufacturer documentation for XC3S400-4FGG456C

Ersa Spartan-3 FPGA      
Ersa Mult DEV EOL 01/Jan/2024      
Ersa Xilinx REACH211 Cert       Xiliinx RoHS Cert      

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