Description: The XC3S400-4FTG256C is a Field Programmable Gate Array (FPGA) device manufactured by AMD (now part of Xilinx). This device belongs to the Spartan-3 generation of FPGAs, which are known for their low cost, low power consumption, and moderate density.
Features:
Programmable Logic: The XC3S400-4FTG256C features a moderate amount of programmable logic resources, making it suitable for a wide range of applications that require customizable logic functions.
I/O Pins: This FPGA has a large number of input/output (I/O) pins, allowing it to interface with various external components and peripherals.
Speed Grade: The "-4" in the model number indicates that this device has a speed grade of -4, which corresponds to a maximum operating frequency of around 400 MHz.
Package Type: The "FTG256" in the model number specifies that the device is housed in a 256-pin FinePitch Ball Grid Array (FBGA) package, which is suitable for applications with space constraints.
Temperature Range: The "C" at the end of the model number indicates that this FPGA is designed for commercial temperature ranges, making it suitable for use in non-industrial environments.
Applications:
Digital Signal Processing: The XC3S400-4FTG256C can be used in digital signal processing applications, such as audio or video processing, where customizable logic functions are required.
Communication Systems: This FPGA can be employed in communication systems, such as network routers or switches, where low power consumption and moderate logic density are important factors.
Control Systems: The XC3S400-4FTG256C is suitable for control system applications, such as industrial automation or robotics, where customizable logic functions and a large number of I/O pins are needed.
Medical Equipment: Due to its commercial temperature range, this FPGA can be used in medical equipment that requires low power consumption and customizable logic functions.
Consumer Electronics: The XC3S400-4FTG256C can be utilized in consumer electronics, such as set-top boxes or gaming consoles, where low cost and moderate logic density are important considerations.
In summary, the AMD XC3S400-4FTG256C is a versatile FPGA device that offers a balance of performance, power consumption, and logic density. Its features make it suitable for a wide range of applications, including digital signal processing, communication systems, control systems, medical equipment, and consumer electronics.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
REACH Status
Mfr
Number of Gates
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XC3S400-4FTG256C Documents
Download datasheets and manufacturer documentation for XC3S400-4FTG256C
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Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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