AMD_XC3S200-4PQG208C
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AMD
XC3S200-4PQG208C

696-XC3S200-4PQG208C
IC FPGA 141 I/O 208QFP

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
221184
Number of LABs/CLBs
480
ECCN
EAR99
Number of I/O
141
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
208-PQFP (28x28)
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XC3S200-4PQG208C Description

The AMD XC3S200-4PQG208C is a high-performance Field Programmable Gate Array (FPGA) that is designed to meet the demands of a wide range of applications. This device is part of the Xilinx Spartan-3A DSP FPGA family, which is known for its low power consumption, high performance, and advanced digital signal processing (DSP) capabilities.

Description:

The XC3S200-4PQG208C is a 4-input, 2-output programmable logic device (PLD) that is based on the Xilinx Spartan-3A DSP FPGA architecture. It features a high-density programmable logic fabric, which allows for the implementation of complex digital logic functions and the integration of various peripherals.

Features:

  1. Advanced DSP capabilities: The XC3S200-4PQG208C includes dedicated DSP blocks, which enable high-speed and low-power processing of digital signals.
  2. Low power consumption: The device is designed to operate at low power levels, making it suitable for battery-powered and energy-sensitive applications.
  3. High-performance programmable logic: The FPGA fabric in the XC3S200-4PQG208C provides high-speed and flexible logic implementation, allowing for the customization of various functions.
  4. Enhanced I/O capabilities: The device features a wide range of I/O options, including LVCMOS, LVDS, and LVTTL, enabling easy integration with other components and systems.
  5. High-density packaging: The XC3S200-4PQG208C is available in a compact 208-ball fine pitch ball grid array (FBGA) package, which allows for high-density integration in various applications.

Applications:

The AMD XC3S200-4PQG208C is suitable for a wide range of applications that require high-performance programmable logic and advanced DSP capabilities. Some potential applications include:

  1. Digital signal processing: The device can be used in various DSP applications, such as audio and video processing, image and video compression, and communication systems.
  2. Embedded systems: The XC3S200-4PQG208C can be used in embedded systems for control and automation, data acquisition, and monitoring applications.
  3. Telecommunications: The FPGA can be employed in telecommunications infrastructure for functions such as line cards, signal processing, and network management.
  4. Industrial control: The device can be used in industrial control systems for motor control, sensor interfacing, and process automation.
  5. Consumer electronics: The XC3S200-4PQG208C can be utilized in consumer electronics for functions such as image processing, audio processing, and user interface management.

In summary, the AMD XC3S200-4PQG208C is a versatile and powerful FPGA that offers advanced DSP capabilities, low power consumption, and high-performance programmable logic. Its wide range of features and applications make it an ideal choice for various industries and applications that require customizable and efficient digital logic solutions.

FAQ

What operating temperature range does XC3S200-4PQG208C support?
XC3S200-4PQG208C has an operating temperature range of 0°C ~ 85°C (TJ).
Are there related or alternative parts for XC3S200-4PQG208C?
What is XC3S200-4PQG208C?
What voltage specification is listed for XC3S200-4PQG208C?
What package or case is XC3S200-4PQG208C available in?
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